Abstract:Ni-7wt.%V is commonly used as the barrier layer material in the under-bump metallurgy in the microelectronic industry. Although interfacial reactions between various solders with the nickel substrate have been investigated intensively, the effects of vanadium addition upon the solder/(Ni,V) interfacial reactions have not been studied. Sn/(Ni,V) and Sn-Ag/(Ni,V) interfacial reactions at 250°C were investigated in this study using the reaction couple technique. The vanadium contents of the (Ni,V) substrates examined in this study are 3 wt.%, 5 wt.%, 7 wt.%, and 12 wt.% and the reaction time is 12 h. The results indicate that when the vanadium contents in the (Ni,V) substrate are 5 wt.% and higher, the Sn/(Ni,V) and Sn-Ag/(Ni,V) interfacial reactions are different from those in the solder/Ni couples. Besides the Ni 3 Sn 4 phase as commonly formed in the reaction with Ni substrate, a new ternary T phase has been found, and the reaction path is L/Ni 3 Sn 4 /T/(Ni,V). A 250°C Sn-Ni-V isothermal section is proposed based on the three constituent binary systems and limited experimental results obtained in this study. The reaction path is illustrated with the proposed Sn-Ni-V isothermal section. No stable ternary Sn-Ni-V phase is found from the phase equilibria study, and the new T phase is likely a metastable phase.

Solid/solid Interfacial Reactions Between Sn–0.7 Wt% Cu and Ni–7 Wt% V

Sn–0.7wt.%Cu/Ni Interfacial Reactions at 250°C

Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C

Interfacial Reactions In Sn-0.7wt.%Cu/Ni-V Couples At 250 Degrees C

Interfacial reaction at 250°C in the Sn/Ni-7wt.%V couple

Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V Couples

Interfacial Reactions in the Sn–20 At.% In/Cu and Sn–20 At.% In/Ni Couples at 160 °C

Interfacial reactions in the Sn–9Zn–(<i>x</i>Cu)/Cu and Sn–9Zn–(<i>x</i>Cu)/Ni couples

Interfacial reactions in the Sn–9Zn–( x Cu)/Cu and Sn–9Zn–( x Cu)/Ni couples

Interfacial Reactions in Sn–(Cu)/Cu6Sn5/Ni Couples at 210 °C

Interfacial reactions in Sn/Ni–7wt.%V couple

Phase Equilibria of the Sn-V System and Interfacial Reactions in Sn/V Couples

Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems

Interfacial reactions of Sn-Cu/Ni couples at 250 degrees C

Interfacial reactions of Sn-Cu/Ni couples at 250 °C

Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

Interfacial Reactions in Sn/Ni-xW Couples

Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples

Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800 °C

Characterization of the ternary phase at the Sn/Ni–V joint

Sn-Co-(Cu) / Ni solid/solid interfacial reactions