Interfacial Reactions in Sn/Ni-xW Couples

sinnwen chen,tungkai chen,juishen chang,chiaming hsu,weian chen
DOI: https://doi.org/10.1007/s11664-013-2927-y
IF: 2.1
2014-01-01
Journal of Electronic Materials
Abstract:Sn-Ag alloys are important solders, and Co and Co alloys are investigated as barrier layers. Interfacial reactions in Sn-Ag/Co couples were examined in this study for Ag contents of 1.0 wt.%, 2.0 wt.%, and 3.5 wt.% and reaction temperatures of 250A degrees C, 200A degrees C, and 150A degrees C. Only CoSn3 formed in Sn-Ag/Co couples reacted at 250A degrees C, but both CoSn3 and Ag3Sn formed in couples reacted at 200A degrees C and 150A degrees C. The reaction layer was 100 mu m thick in Sn-3.5 wt.%Ag/Co couples reacted at 200A degrees C for 110 h. The reaction rates were lower if Ag was added, but remained very fast compared with those for Ni and Ni-based substrates.
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