Abstract:SnSe2 is a promising thermoelectric compound. Ni is a commonly used barrier layer material. To provide fundamental information, Ni-Se-Sn phase equilibria isothermal sections and Ni/SnSe2 interfacial reactions at 500 degrees C and 300 degrees C are determined. Significant and peculiar interfacial reaction results are observed. The reaction zone has several phase regions, and within each phase region there are various phases, and yet these regions have clear boundaries with different average compositions. In the Ni/SnSe2 couples reacted at 500 degrees C, there are three phase regions with average compositions equal to Ni5SnSe2, Ni3SnSe2 and NiSnSe2. In those reacted at 300 degrees C, there are four phase regions with average compositions of Ni5SnSe2, Ni3SnSe2, Ni2SnSe2 and NiSnSe2. The sig-nificant interfacial reactions indicate Ni is not a suitable barrier layer for SnSe2. The reaction phase regions all have planar interfaces and fine microstructures, but they are not single-phase. The experimental results show the microstructures are unaffected by the quenching rates and become coarser with longer annealing time. These results indicate the different phases within each phase region are not formed during quenching. The mechanisms of the peculiar phenomena need to be further explored. Yet, preliminary speculation is metastable ternary phases are formed with the rapid diffusion of Ni atoms into the SnSe2 substrate. The reaction phase regions grow with the formation of the metastable ternary phases, and the thin metastable ternary phases decompose into stable phases with fine microstructures.

Interfacial reaction at 250°C in the Sn/Ni-7wt.%V couple

Interfacial reactions in Sn/Ni–7wt.%V couple

Phase Equilibria of the Sn-V System and Interfacial Reactions in Sn/V Couples

Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C

Characterization of the ternary phase at the Sn/Ni–V joint

Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V Couples

Solid/solid Interfacial Reactions Between Sn–0.7 Wt% Cu and Ni–7 Wt% V

Interfacial Reactions In Sn-0.7wt.%Cu/Ni-V Couples At 250 Degrees C

Interfacial Reactions in the Sn–20 At.% In/Cu and Sn–20 At.% In/Ni Couples at 160 °C

Sn–0.7wt.%Cu/Ni Interfacial Reactions at 250°C

Evolution of the Sn/Ni–8.0 At.%v Interfacial Reaction Paths

Interfacial Reactions in Sn–(Cu)/Cu6Sn5/Ni Couples at 210 °C

Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems

Interfacial Reactions in Sn/Ni-xW Couples

Interfacial reactions of Sn-Cu/Ni couples at 250 degrees C

Electromigration Effects Upon the Sn∕Ni–7wt%V Interfacial Reactions

Interfacial reactions of Sn-Cu/Ni couples at 250 °C

Interfacial Reactions in In-Sn/Ni Couples and Phase Equilibria of the In-Sn-Ni System

Interfacial Reactions in Ni/Se-90 At.%te and Ni/Pb1-xSnxSe Couples

Ni/SnSe2 Interfacial Reactions and Ni–Se–Sn Phase Equilibria

Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints