Studies on Poly Si_(0.7)Ge_(0.3) Films Deposited by UHVCVD as Thermal Sensitive Material for Bolometer

YUE Rui-feng,DONG Liang,LIU Li-tian
DOI: https://doi.org/10.3969/j.issn.1005-9490.2006.04.004
2006-01-01
Abstract:According to the requirements of bolometer on thermal-sensitive materials,the poly Si_(0.7)Ge_(0.3) thin film was deposited by ultrahigh vacuum chemical vapour deposition(UHVCVD) system,and the dependences of the temperature coefficient of resistance and electrical conductivity of the film on B-ion implantation dose and annealing processes have been investigated.Therefore,the optimal process parameters of fabricating poly Si_(0.7)Ge_(0.3) film for thermal sensitive material were obtained.Using this material,we developed a bolometer with detectivity of as big as 3.75×10~8cm·Hz~(1/2)/W~.
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