Low-Temperature Sintering of In-Plane Self-Assembled ZnO Nanorods for Solution-Processed High-Performance Thin Film Transistors

B. Sun,R. L. Peterson,H. Sirringhaus,K. Mori
DOI: https://doi.org/10.1021/jp077740f
2007-01-01
Abstract:ZnO is an attractive active semiconducting material for thin-film transistor (TFT) applications due to its high band gap, high mobility, ease of forming Ohmic contacts, and low toxicity. Here we present a process for solution fabrication of ZnO TFTs based on a simple, double-layer spin-coating process during which a dense layer of in-plane zinc oxide nanorods is deposited first, followed by coating of a chemical precursor solution and low-temperature annealing. First, a lower ZnO nanorod concentration can lead to the self-assembly of nanorods along the in-plane direction to form a relatively dense semiconductor layer. Then the chemical precursor solution sinters the nanorods and improves the contact between them. The n-channel TFTs exhibit high ON/OFF ratio of 10(5)-10(6), mobilities of similar to 1.2 cm(2) V-1 s(-1) and low threshold voltages of about -4 V with low hysteresis. We show that the quality of the semiconductor film and the minimum annealing temperature depends sensitively on the thickness and composition of the two layers.
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