Abstract:Textile wearable electronics offer the consolidated advantages of both electronics and textile characteristics. Wearable electronic systems typically require conductive tracks as a platform to integrate electronic components. Herein we developed a site-selective electroless plating process to construct dual-side Cu patterns onto textile substrates. The proposed craft was mainly comprised of four procedures, namely, 3-aminopropyltrimethoxysilane (APTMS)-modification, wax-pattern printing, selective Au-seeding and Cu-pattern deposition. Specifically, waxes were transferred from commercial wax impregnated papers to APTMS modified fabrics with the aid of a conventional stylus printer. Intensive waxed dots then composed a wax pattern which corresponded to the input image designed on the computer. The wax pattern acted as a hydrophobic mask on the fabric surface and hindered the covered areas from being activated by subsequent Au catalysts. The non-covered areas, in contrast, were APTMS naked surfaces which normally adsorbed Au nanoparticles and had Cu tracks grown. The minimum width of the Cu track was 400 mu m with 3.57% deviation and the typical resistivity was 7.52.0 mu Omega cm, which was about 4.6 times that of the bulk metal Cu (at room temperature). The reliabilities of textile-based conductive Cu patterns were confirmed by air-exposure, ultrasonic washing and Scotch (R)-tape tests. In addition, the universality and versatility of the proposed method were validated by fabricating different metal patterns on various types of flexible substrates.

Process for Uniformly Electroplating A Patterned Wafer with Electrically Isolated Devices

Region-selective electroless gold plating on polycarbonate sheets by UV-patterning in combination with silver activating

Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level

Patterned Au/poly(dimethylsiloxane) substrate fabricated by chemical plating coupled with electrochemical etching for cell patterning.

Fabrication of Patterned Polymer Resists for Ion Etching by Using Dewetting

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Plasma Dry Etched P-Silicon Micromolds for Permalloy Microstructure Array Electrodeposition

Two-Stage Tunneling-Dominated Electrodeposition for Large-Scale Production of Ultralong Wavy Metal Microstructures on Native Oxide Layer-Passivated Si Electrode with Specific Surface Configuration

Electroless Cu Deposition Process on TiN for ULSI Interconnect Fabrication Via Pd/Sn Colloid Activation

Electrochemical processes for the production of copper interconnects on non-metallic barrier layers

Molecular Self-Assembly Combined with Electroless Copper Plating of Laser-Induced Patterning on Polyimide Film

3D Lithography and Deposition on Highly Structured Surfaces Using Plasma Surface Modification, SAM Coating, and Contact Displacement Electroless Plating

Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process

Fabrication of nanopatterned metal layers on silicon by nanoindentation / nanoscratching and electrodeposition

High‐resolution patterning of conductive microstructures by electrostatic deposition of aerosol Au nanoparticles through the dielectric mask

Wet-Etch Method for Patterning Metal Electrodes Directly on Amorphous Oxide Semiconductor Films

A Three-Dimensional Microfabrication Technology on Highly Structured Surfaces

Electroless acid-based plating Cu on TiNi/Ti/SiO2/Si substrate

Molecular plating of actinide compounds on wafer-scale aluminum substrate

Solid-state electrochemical oxidation with polyelectrolyte membrane stamps for micro-/nanoscale pattern formation on Au surfaces

Custom Writing Catalytic Tracks for Selective Pattern Metallization on Flexible Substrate