Abstract:We develop a series of electrochemical plating (ECP) baths and processes, generating nano-twinned Cu (nt-Cu) in wafer-level packaging (WLP) applications to fulfill the expanding market demand for copper-to-copper direct bonding and hybrid-bonding. This newly developed system shows a high density of nt-Cu (close to 100%), controllable grain size (0.10 to 1.0 micron), vertical columnar structure (through the full height), and minimal transition layer between Cu seed and nt-Cu initial position (dozens of nanometers). These systems have expansive operating windows which produce high-density nt-Cu films: from the inorganic electrolyte concentrations, including copper, acid and chloride, to the ECP current density, ECP current waveform, agitation speed and additive concentrations. The new ECP system consists of one, two or three additives, depending on the applications, and we demonstrated that this sytem could fill multiple WLP features with a high density of nt-Cu and a flat surface. Unlike the features without recess, there exist more challenges for the components with PI-recess. The balance between conformal and bottom-up ECP must be well-controlled to achieve a flat surface without affecting the nt-Cu formation. To do so, we used two or three additives in the system, including the one that promotes bottom-up fill. Although having an additional additive in the electrolyte weakens the formation of nt-Cu to a certain level, we achieved the balance successfully by adjusting electrolyte compositions and ECP parameters for a series of WLP features. The working window of ECP parameters for generating nt-Cu structure is relatively wide. To achieve a uniform and flat surface of a high density of nt-Cu for specific WLP features, the additive concentrations and plating current waveform should be well-controlled. They are more critical than other parameters for controlling the ECP nt-Cu performance. We evaluated numerous waveforms, such as constant current, multistep current, ramping current ECP and other waveforms to generate nt-Cu films. At the current stage, both within die (WID) and within feature (WIF) of ECP nt-Cu for WLP features tested can be as low as 5.00 % with high density, columnar orientation, and less transition layer nt-Cu. Contrary to some published literature, our ECP process can produce nt-Cu films with Cu(111) orientation irrespective of the direction of the base substrate. Our ECP nt-Cu process does not appear to exhibit such substrate-dependent preference. We can generate high-density nt-Cu films using Cu (111) dominating seed layer and non-Cu (111) dominating substrates and even using stainless steel substrates. This paper will attempt to discuss additive functions, the mechanism of the balance between conformal and bottom-up ECP process, agitation speed, plating current waveform, multi-bath plating, electrolyte compositions, and substrate influence.

Two-Stage Tunneling-Dominated Electrodeposition for Large-Scale Production of Ultralong Wavy Metal Microstructures on Native Oxide Layer-Passivated Si Electrode with Specific Surface Configuration

High-metallic-phase-concentration Mo1–xWxS2 nanosheets with expanded interlayers as efficient electrocatalysts

Fabrication of the Pattern of Copper Nanowires with Adjustable Density on Oxidized Si Substrate

Operando Synthesis of High-Curvature Copper Thin Films for CO2 Electroreduction

Innovative Multiphase Ultrasonic-Assisted Method for High-Purity, Stable, and Cost-Effective Copper Nanowire Synthesis

Synthesizing Cu-Sn nanowires alloy in highly-ordered Aluminum Oxide templates by using electrodeposition method

Surface Engineering on Segmented Copper-Iron Nanowires Arrays

Direct microfabrication of oxide patterns by local electrodeposition of precisely positioned electrolyte: the case of Cu2O

Scalable Edge-Oriented Metallic Two-Dimensional Layered Cu2Te Arrays for Electrocatalytic CO2 Methanation.

Structure Induced Wide Range Wettability: Controlled Surface of Micro-Nano/nano Structured Copper Films for Enhanced Interface

A General Method for the Large-Scale Synthesis of Uniform Ultrathin Metal Sulphide Nanocrystals

Extreme wettability due to dendritic copper nanostructure via electrodeposition

Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP Features

Controllable Synthesis of Bowl-Like Cu Array Prepared by Electrodeposition Through Multilayer Colloidal Template

Formation of Arrays of Straight Copper Wires on Solid Substrate by Electrodeposition

Growth and Branching Mechanisms of Electrochemically Self-Organized Mesoscale Metallic Wires

Multilayer Graphene Interface Enabled Ultrahigh Extensibility for High Performance Bulk Nanostructured Copper

In Situ Synthesis of CuO and Cu Nanostructures with Promising Electrochemical and Wettability Properties

Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

<i>In situ</i> coating of a lithiophilic interphase on a biporous Cu scaffold with vertical microchannels for dendrite-free Li metal batteries

An Additive-Free Electrochemical Route to Rapid Synthesis of Large-Area Copper Nano-Octahedra on Gold Film Substrates