Abstract:Nanoporous copper (np-Cu) films that feature fine ligament length scales and high surface area are prepared using an all-electrochemical approach. The two-step routine involves initially the electrodeposition of CuxZn(100−x) precursor alloy films with controlled thickness and composition from a pyrophosphate bath. This is followed by a selective oxidative removal or dealloying of Zn that leads to a surface area increase (by up to 22 times per one μm thickness of the precursor alloy). In this article, we present a systematic investigation of the impact of three factors on the as-synthesized np-Cu structure: (1) dealloying bath composition, (2) atomic composition (at.%) of precursor alloy, and (3) addition of Ni. Our results show that varying the dealloying bath composition allows for tunable ligament and pore sizes that are due to the anion-induced (ClO4−, SO42−, or Cl−) modified surface diffusivity of Cu. The increase in surface area is also proportionally scalable by modifying the Cu content (12–42 at.%) in the precursor alloy. Thus, np-Cu films with porosity length scales in the range of 20–33 nm were obtained. A further np-Cu length scale refinement down to 10–12 nm was achieved after dealloying of a ternary Cu–Zn–Ni(3%) alloy. Overall, the strict parameter control yields a wide range of nano-scaled np-Cu films with specific surface characteristics, which may be suitable for various applications including microelectronic packaging, sensing, and catalysis. We are presenting the first (to the best of our knowledge) comprehensive study on a proposed all-electrochemical approach for the synthesis of nanoporous (np) Cu films with controllable thickness, porosity length scale, and pore-ligament ratio (pore-volume). The novelty of this approach is the use of electrochemical means to synthesize the precursor alloy (Cu–Zn in this work, also Cu–Mn, Cu–Al, etc.) followed by its subsequent dealloying, as opposed to most other approaches that employ dealloying of commercially available bulk precursor alloys and/or thin alloy films deposited in ultrahigh vacuum. The cost-effective use of electrodeposition routines allows for strict composition, thickness, and shape control of the deposit. Also, the deposition of precursor alloys with a desired composition (in turn) enables the development of np-Cu films with controlled pore-ligament length scale as well as pore-ligament ratio. Finally, the proposed approach allows for fine-tuning of the structure, morphology, and ligament/surface elemental content of the as-synthesized np-Cu structure by introducing additional doping metals (Ni) into the precursor alloy. Overall, the systematic study of the proposed approach largely enables versatile and scalable synthetic routes for the preparation of np-Cu-based architectures for a variety of applications ranging from electrocatalysis (CO2 fixation, H2 energy, fuel cells), sensing and actuation (NO3− reduction, NO2− analysis), environmental remediation (tap water purification from toxic compounds), and 2.5/3D electronic packaging (realization of Cu-on-Cu bonding or defect-free and limited in Sn, Cu-Sn micro-bonding in miniaturized devices). Preparation of fine-structured nanoporous copper films using an all-electrochemical method.

An Additive-Free Electrochemical Route to Rapid Synthesis of Large-Area Copper Nano-Octahedra on Gold Film Substrates

Uniform Electrochemical Deposition of Copper onto Self-Assembled Gold Nanoparticles

Facile Electrochemical Synthesis of Single-Crystalline Copper Nanospheres, Pyramids, and Truncated Pyramidal Nanoparticles from Lithia/Cuprous Oxide Composite Thin Films

Templateless, Surfactantless, Simple Electrochemical Route to Rapid Synthesis of Diameter-Controlled 3d Flowerlike Gold Microstructure with "clean" Surface

Electrodeposition and Characterization of Copper Nanocone Structures

Shape-controlled electrodeposition of gold nanostructures.

Controllable Synthesis of Metal Particles by a Direct Current Electrochemical Approach

Large-area and High-Density Gold Nanoparticle Arrays with Sub-10 Nm Gaps

Operando Synthesis of High-Curvature Copper Thin Films for CO2 Electroreduction

All-electrochemical synthesis of tunable fine-structured nanoporous copper films

Additives induced localized electrodeposition manufacturing of high quality copper micro-rectangular solid structures

Copper nanocubes and nanostructured cuprous oxide prepared by surfactant-assisted electrochemical deposition

Direct Electrochemical Fabrication of Metallic Nanopillar Array on Au Electrode Surface by the Template Technique

Electrochemical Synthesis of Copper Sulfide Nanostructure with PAM Hydrogel Template

Controllably Constructing Gold Nanostructures on Electrodes Through Growth of Zinc Oxide Nanorods and Two-Step Electroplating

Localized Electrochemical Deposition Using Copper Pyrophosphate-Based Electrolyte

In Situ Growth of Densely Packed Single-Crystal Copper Nanocone Structure Films with Condensate Microdrop Self-Removal Function on Copper Surfaces

Fabrication of Free-Standing Cu Nanorod Arrays on Cu Disc by Template-Assisted Electrodeposition

Facile Electrochemical Approach to Fabricate Hierarchical Flowerlike Gold Microstructures: Electrodeposited Superhydrophobic Surface

Flowerlike Ag microparticles with novel nanostructure synthesized by an electrochemical approach

Electrochemical Synthesis of Nanostructured Palladium of Different Morphology Directly on Gold Substrate through a Cyclic Deposition/Dissolution Route