Abstract:The green transition requires the preparation of clean, inexpensive, and sustainable strategies to prepare controllable bimetallic and multimetallic nanostructures. Cu-Ag nanostructures, for example, are promising bimetallic catalysts for different electrocatalytic reactions such as carbon monoxide and carbon dioxide reduction. In this work, we present the one-step preparation method of electrodeposited Cu-Ag with tunable composition and morphology from choline chloride plus urea deep eutectic solvent (DES), a non-toxic and green DES. We have assessed how different electrodeposition parameters affect the morphology and composition of our nanostructures. We combine electrochemical methods with ex-situ scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS) to characterize the nanostructures. We have estimated the electrochemically active surface area (ECSA) and roughness factor (R) by lead underpotential deposition (UPD). The copper/silver ratio in the electrodeposited nanostructures is highly sensitive to the applied potential, bath composition, and loading. We observed that silver-rich nanostructures were less adherent whereas the increase in copper content led to more stable and homogenous films with disperse rounded nanostructures with tiny spikes. These spikes were more stable when the deposition rate was fast enough and the molar ratio of Cu and Ag no greater than approximately two to one.

Electrochemical fabrication of nanoporous copper films in choline chloride-urea deep eutectic solvent

Preparation and electrochemical corrosion behaviour of 3D large-sized nanocrystalline copper bulk in solutions with chloride ions

Direct copper plating on ultra-thin sputtered cobalt film in an alkaline bath

Preparation of nanoporous copper foil by chemical dealloying from electro-deposited CuZn alloy

Fabrication and Wettability of Nanoporous Silver Film on Copper from Choline Chloride-Based Deep Eutectic Solvents

Structure and Properties of Electrocodeposited Cu-Al2o3 Nanocomposite Thin Films

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Eco-Friendly Electrodeposition of Al-Zn Alloy from AlCl3-Urea Deep Eutectic Solvent

Fabrication and Functionalization of Tunable Nanoporous Copper Structures by Hybrid Laser Deposition and Chemical Dealloying

Electrodeposition, Structural, and Corrosion Properties of Cu Films from A Stable Deep Eutectics System with Additive of Ethylene Diamine

Electrodeposition of Superhydrophobic Cu Film on Active Substrate from Deep Eutectic Solvent

Fabrication of Nanoporous Metal by Selective Electrochemical Dealloying from Laser Cladding Cu-Mn Alloys

Electroless Deposition of Automatically Shedded Thin Copper Foils

Electrochemical Synthesis and Characterization of Mesoporous Cu/Cu2O Films

Facile Electrochemical Synthesis of Single-Crystalline Copper Nanospheres, Pyramids, and Truncated Pyramidal Nanoparticles from Lithia/Cuprous Oxide Composite Thin Films

Fabrication of Cu-Ni Alloy Microcomponents using Localized Electrochemical Deposition

Study on electrodeposition behaviour and corrosion resistance of nickel-copper alloy in ChCl-EG deep eutectic solvents

Electrochemical surface nanostructuring of copper using fluoride and chloride

Porosity evolution and oxide formation in bulk nanoporous copper dealloyed from a copper-manganese alloy studied by in situ resistometry

An Additive-Free Electrochemical Route to Rapid Synthesis of Large-Area Copper Nano-Octahedra on Gold Film Substrates

Preparation of tunable Cu-Ag nanostructures by electrodeposition in a deep eutectic solvent