Abstract:Thermoelectric materials have a wide range of application because they can be directly used in refrigeration and power generation. And the Bi2Te3 stand out because of its excellent thermoelectric performance and are used in commercial thermoelectric devices. However, n-type Bi2Te3 has seriously hindered the development of Bi2Te3-based thermoelectric devices due to its weak mechanical properties and inferior thermoelectric performance. Therefore, it is urgent to develop a high-performance n-type Bi2Te3 polycrystalline. In this work, we employed interstitial Cu and the hot deformation process to optimize the thermoelectric properties of Bi2Te2.7Se0.3, and a high-performance thermoelectric module was fabricated based on this material. Our combined theoretical and experimental effort indicates that the interstitial Cu reduce the defect density in the matrix and suppresses the donor-like effect, leading to a lattice plainification effect in the material. In addition, the two-step hot deformation process significantly improves the preferred orientation of the material and boosts the mobility. As a result, a maximum ZT of 1.27 at 373 K and a remarkable high ZTave of 1.22 across the temperature range of 300−425 K are obtained. The TEG (7-pair) and TEC (127-pair) modules were fabricated with our n-type textured Cu0.01Bi2Te2.7Se0.3 coupled with commercial p-type Bi2Te3. The TEC module demonstrates superior cooling efficiency compared to the commercial Bi2Te3 device, achieving a ΔT of 65 and 83.4 K when the hot end temperature at 300 and 350 K, respectively. In addition, the TEG module attains an impressive conversion efficiency of 6.5% at a ΔT of 225 K, which is almost the highest value among the reported Bi2Te3-based TEG modules.

Microfabrication of Thermoelectric Modules by Patterned Electrodeposition Using a Multi-Channel Glass Template

Fabrication and evaluation of microscale thermoelectric modules of Bi<sub>2</sub>Te<sub>3</sub>-based alloys

Fabrication And Evaluation Of Microscale Thermoelectric Modules Of Bi2te3-Based Alloys

Fabrication and Performance Simulation of Microscale Thermoelectric Modules Made with Bi2Te3-Based Alloys

Design and Simulation of a Novel Thermoelectric Micro-Device with Electrodeposited Bi-Te Alloys

Manufacturing thermoelectric micro modules using micromachined silicon wafers

Micro-thermoelectric Devices with Large Output Power Fabricated on a Multi-Channel Glass Template

Microfabrication of thermoelectric materials by silicon molding process

Electrodeposition of Bi-Te Thin Films on Silicon Wafer and Micro-Column Arrays on Microporous Glass Template

Development of Thermoelectric Microdevices by Combining Materials Processing and Silicon Micromachining Technology

Realizing High-Efficiency Thermoelectric Module by Suppressing Donor-Like Effect and Improving Preferred Orientation in N-Type Bi2(Te, Se)3

Electrodeposition of P-Type Sb2Te3 Films and Micro-Pillar Arrays in a Multi-Channel Glass Template

Micro-thermoelectric Generators Based on Through Glass Pillars with High Output Voltage Enabled by Large Temperature Difference

Design and Fabrication of Segmented GeTe/(Bi,Sb)2Te3 Thermoelectric Module with Enhanced Conversion Efficiency

A High Power Density Micro-Thermoelectric Generator Fabricated by an Integrated Bottom-Up Approach

Flexible Carbon Nanotube‐Epitaxially Grown Nanocrystals for Micro‐Thermoelectric Modules

Direct Melt-Calendaring of Highly Textured (Bi,Sb)2Te3 Thick Films: Superior Thermoelectric and Mechanical Performance via Strain Engineering

Deposition and Fabrication of Sputtered Bismuth Telluride and Antimony Telluride for Microscale Thermoelectric Energy Harvesters

Recent advances of electrodeposition of Bi2Te3 and its thermoelectric applications in miniaturized power generation and cooling

Synergistically enhanced thermoelectric and mechanical performance of Bi 2 Te 3 via industrial scalable hot extrusion method for cooling and power generation applications

Interfacial Design Contributing to High Conversion Efficiency in Mg3(Sb, Bi)2/Bi2Te3 Thermoelectric Module with Superior Stability