Thinning of Lithium Niobate Wafers with a Novel Designed Lapping Tool and Measurements

DU Wen-long,LIANG Ting,XUE Chen-yang,TANG Jian-jun,YE Ting
DOI: https://doi.org/10.14136/j.cnki.issn1673-2812.2010.06.022
2010-01-01
Abstract:Because of the pyroelectric effects,infrared sensors made of lithium niobate have attracted much attention for its potential applications.A lithium niobate wafer and a silicon substrate were bonded together at 200℃ under a pressure of 100N.Lithium niobate had been thinned to 40 microns using a novel designed lapping tool.The abrasive contains water and corundum with a ratio of 1∶1.The bonding and thinning process of lithium niobate was studied.The residual stress was analyzed by Raman spectroscopy.Sample surface roughness was tested by atomic force microscopy.Maximum difference of wafer thickness is 7 microns.After grinding,surface roughness of the wafer is 118nm.Lithium niobate chips processed by our procedure can be used as infrared sensors.
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