Hexagonal Defects Analysis of GaN Epilayers Grown on Si Substrates

Yin Jiayun,Liu Bo,Wang Jingjing,Zhou Rui,Li Jia,Dun Shaobo,Feng Zhihong
DOI: https://doi.org/10.3969/j.issn.1671-4776.2010.10.003
2010-01-01
Abstract:Two GaN samples were grown on Si(111)substrates by changing the growth temperature of AlN nucleation layers,and the hexagonal defects on the GaN epitaxial surface were investigated.Through the microscope and SEM,it is found that a large number of hexagonal defects generated on the GaN epitaxial surface,when the AlN nucleation layer was grown at high temperature.Analyzing by EDS,the hexagonal defects mainly contain Si elements and a little Ga and Al elements,the Si elements in the hexagonal defects are diffused from Si substrates.The hexagonal defects of the GaN material layer disappear as the growth temperature of the AlN nucleation layer decreases.It is indicated that when the AlN nucleation layer is grown at a lower temperature,the Si diffusion from the substrate surface is effectively suppressed,and the hexagonal defects of the GaN epitaxial surface due to the Si anti-diffusion from the substrate surface are reduced.
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