Improvement of Surface Light Extraction from Flip‐chip GaN‐based LED by Embossing of Thermosetting Polymers

Kui Bao,Bei Zhang,ZhiMin Wang,Tao Dai,XiangNing Kang,ZhiZhong Chen,Ke Xu,Hang Ji,Yong Chen,ZiZhao Gan
DOI: https://doi.org/10.1002/pssc.200673519
2007-01-01
Abstract:In this report, a further improvement of surface light extraction from flip-chip GaN-based LED was obtained by the micro patterning of encapsulation on the sapphire. The two dimensional taper arrays with period from 6 to 10 micron were successfully realized on polymer encapsulation by a simple and low cost technique so called embossing of thermosetting polymers. As a preliminary demonstration, at least 1.74 enhancement of the surface output intensity was achieved in the 1 mm x 1 mm GaN-based LED device under the injection current of 350 mA. (c) 2007 WILEYNCH Veriag GmbH & Co. KGaA, Weinheim.
What problem does this paper attempt to address?