Mo/Cu System Functionally Graded Material Prepared by Hot-pressing Infiltration Sintering

CHEN Wen-ge,SHEN Hong-fang,LIU Xing
DOI: https://doi.org/10.3969/j.issn.2095-1744.2006.01.003
2006-01-01
Abstract:The microstructure of Mo/Cu functionally graded materials fabricated by hot pressing infiltration sintering is observed by backscattered scanning electron microscope and some properties,such as density,hardness,electrical conductivity and thermal fatigue resistance,are measured and analyzed.The results show that Mo/Cu functionally graded materials with copper content from 10%~50% can be prepared by sintering at 1100℃ and 10MPa in hydrogen protective atmosphere for 2h.The microstructure is varied in gradient,and the density of each layer is up to 98% of theoretical density,higher than that with other sintering process.The hardness of transition layers reduces with the increase of copper content.The electrical conductivity of Mo/Cu functionally graded materials in integer is better than that from other process,and the thermal fatigue resistance is excellent.
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