Abstract:In order to solve problems of significant interfacial reactions and agglomeration in graphene reinforced W-Cu composites, powders of copper coated graphene (Cu@Gr) were pre-mechanically mixed with tungsten and copper powders, and then graphene doped W-Cu composites were sintered using two different methods, e.g., spark plasma sintering (SPS) and infiltration sintering. Microstructural analysis showed that the doped Cu@Gr powder can effectively inhibit the interfacial reaction between graphene and tungsten, prevent the segregation of graphene, and evenly distribute the copper in the binder phase. When the mixed concentration of Cu@Gr was 0.45 wt%, uniform distributions of W phase and Cu phase were obtained in the composite, and the mechanical properties and conductivity of this composite achieved their best results. When the doping content was further increased to 0.8%, WC phase was found in all alloys, thus resulting in poor mechanical and physical properties. Comparing the microstructures produced using these two methods, the composites prepared using the infiltration sintering method showed network distribution of copper phase and segregation of copper, whereas the composites prepared using the SPS method showed network skeleton phase of tungsten. Although the SPS process was performed in a much shorter time, the mechanical properties of the composites sintered using the SPS process did not show much differences with those sintered using the infiltration sintering method.

Functionally Graded W-Cu Materials Prepared from Cu-Coated W Powders by Microwave Sintering

HIGH HEAT LOAD PROPERTIES OF W/Cu FUNCTIONALLY GRADED MATERIALS

Fabrication of W–Cu Functionally Graded Material with Improved Mechanical Strength

Microstructure and Properties of Wcp/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed Sintering

Fast fabrication of W-Cu functionally graded material by high-gravity combustion synthesis and melt-infiltration

Fabrication and properties of W-Cu functionally graded materials by tape calendaring method

Fabrication and microstructure of W/Cu functionally graded material

W–Cu Composite with High W Content Prepared by Grading Rounded W Powder with Narrow Particle Size Distribution

Fabrication of Diamond/w–cu Functionally Graded Material by Microwave Sintering

Fabrication of W/Cu Graded Heat-sink Materials by Electroless Plating and Powder Metallurgy

Fabrication and Properties of Axisymmetric WC/Co Functionally Graded Hard Metal via Microwave Sintering

Preparation and Properties of W-15Cu Composite by Electroless Plating and Powder Metallurgy

Microstructure and Properties of W Cu Composites with Low Copper Content at Different Sintering Temperatures

Sintering Behavior of W–30Cu Composite Powder Prepared by Electroless Plating

Enhanced mechanical properties and thermal conductivity of W-30Cu composite fabricated with monodisperse and nearly spherical W powder

Improved parallelism of graded W–Cu–SiC materials by adjusting the coefficient of thermal expansion

Fabrication and microstructure of W-Cu composites prepared from Ag-coated Cu powders by electroless plating

Effect of sintering temperature on fine-grained Cu W composites with high copper

Fabrication Of Sic/Cu Functionally Gradient Material By Graded Sintering

Preparation and properties of Al2O3 dispersed fine-grained W-Cu alloy

W-Cu Composites Reinforced by Copper Coated Graphene Prepared Using Infiltration Sintering and Spark Plasma Sintering: A Comparative Study