Study of Single-wafer Megasonic Cleaning and Optimization of Megasonic Nozzle

LIU Yongjin,DU Jianke,FENG Xiaoqiang

DOI: https://doi.org/10.3969/j.issn.1004-4507.2011.01.005

2011-01-01

Abstract:Based on the theory of single-wafer megasonic cleaning,measures are anlysised,and an improved measure is indicated.

What problem does this paper attempt to address?

Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing

Kun Li,Changkun Li,Tongqing Wang,Dewen Zhao,Xinchun Lu

DOI: https://doi.org/10.1149/2162-8777/ac9c2e

IF: 2.2

2022-01-01

ECS Journal of Solid State Science and Technology

Abstract:Cleaning processes draw considerable attention in integrated circuit manufacturing because of the rapid development of technology nodes. Bare silicon wafer cleaning after chemical mechanical polishing (CMP) is one of the most difficult processes used to meet the extremely strict industrial requirements. Herein, the silicon wafer cleaning mechanism is studied in detail. The effects of megasonic and brush cleaning on nanoparticle removal are both analysed through experiments and simulations. The experimental results show that chemical concentration, megasonic vibration power, and brush clamp gap all significantly affect the cleaning performance, and that excessive megasonic power reduces the cleaning performance because more defects are introduced. A model of megasonic nozzle trajectory is also proposed, and optimized parameters, especially the relative velocity between the wafer rotation and nozzle movement, are critical to removing nanoparticles effectively. Furthermore, analysis of combining megasonic and brush cleaning shows that including megasonic cleaning improves the wafer cleaning performance by several orders of magnitude. Based on the optimized cleaning conditions, an ultraclean wafer surface is achieved after CMP.
Study on the processing mechanism of two-dimensional ultrasonic polishing without abrasives

JIANG Jianjun,ZHENG Jianxin,LIU Chuanshao

DOI: https://doi.org/10.3969/j.issn.1005-2402.2012.05.027

2012-01-01

Abstract:According to process of two-dimensional ultrasonic polishing without abrasives, the processing mechanism of two-dimensional ultrasonic polishing without abrasives were studied from the ratio change characteristics, the duty ratio, the deformation of metal surface, the energy concentration effect, the anti-vibration performance and the friction nature.
Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming

Bingjiang Guo,Liqun Du,Shuai Wang,Zhongmin Wang,Dong Li,Junshan liu

DOI: https://doi.org/10.1016/j.colsurfa.2024.134109

IF: 5.518

2024-05-02

Colloids and Surfaces A Physicochemical and Engineering Aspects

Abstract:In order to promote the bubble removal in the fabrication process of micro structure and enhance nickel micro electroforming, megasonic field was introduced in this paper. Electrochemical measurement was used to analyze the effects of megasonic on micro electroforming, including tests on curves of cycle voltammetry, linear sweep voltammetry, Tafel and electrochemical impedance spectroscopy. Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming was revealed and micro structures with different dimensions were fabricated. Results of electrochemical measurement demonstrated that megasonic filed not only can promote the sufficient contact between substrate and electroforming solution, but also can decrease solution resistance and increase current. Besides, megasonic field can promote nickel deposition and weaken hydrogen evolution, improving the current conversion efficiency. Fabrication results verified that megasonic field is beneficial to promote bubble removal from the surface of electroforming area. Less surface defects, higher processing efficiency and higher success rate of micro structures fabrication can be accomplished under 6 W cm -2 megasonic field. This study may provide novel idea and method on fabrication of micro-nano structure.

chemistry, physical
An Experimental Study of Atomization Characteristics of the Ultrasonic Spray Nozzle

de gang qu,dong xiang,lei ming he,guang hong duan,peng mou

DOI: https://doi.org/10.4028/www.scientific.net/AMR.230-232.958

2011-01-01

Abstract:The recent development in advanced packaging and MEMS applications has created a need for high aspect ratio lithography processes, ultrasonic spray coating is a very appropriate method to meet this requirement, the parameters of atomization are greatly affected the spray quality. By using a laser-phase Doppler analyzer (PDA), an experimental study was conducted of the atomization characteristics of the ultrasonic spray nozzle, water was used as the liquid to be atomized instead of photoresist and air was used as the auxiliary gas instead of nitrogen, the parameters of atomization characteristics under different operating conditions were measured, such as mean diameter D-10 and diameter distribution of atomized droplet particles etc. The experimental measurement results indicate that the flow rate of atomized liquid and auxiliary gas have a significant impact on the spray characteristics, the nozzle can achieve a comparatively good atomization state under the condition of a relatively small flow rate of atomized liquid or a relatively high flow rate of auxiliary gas, the mean diameter D-10 of droplets can be 18.39 mu m. The research findings can provide an underlying basis for the application of the ultrasonic spray nozzle.
Study of Anisotropic Etching of (100) Si with Ultrasonic Agitation

Y Xu

DOI: https://doi.org/10.1016/s0924-4247(01)00786-5

2002-01-01

Abstract:High precision bulk micromachining based on wet anisotropic etching of silicon is essential for the fabrication of MEMS devices. For the most commonly used KOH and tetramethylammonium hydroxide (TMAH) anisotropic etching, ultrasonic agitation has been introduced to reduce the surface roughness and improve the etching uniformity. Etching characteristics of (100) Si have been studied and compared with that using magnetic stirring and that using no agitation. Smooth pyramid-free surfaces were obtained with the uniform etching depth within the resolution of 1μm on the same wafer being achieved at the same time. The results reveal that the ultrasonic agitation is a very efficient way to achieve smooth, defect-free silicon surface with high dimensional uniformity on the whole wafer.
Study of liquid-phase mass transfer and residual stress in jet electrodeposition process with coaxial megasonic agitation

Ke Zhai,Feng Zhou,Yifan Wang,Shihao Ma,Lide Fang,Liqun Du

DOI: https://doi.org/10.1016/j.ultsonch.2024.107019

Abstract:The electrodeposition process confronts significant challenges arising from mass transfer limitation and residual stress. To address these issues, an innovative method, combining megasonic agitation with coaxial jet electrodeposition, is introduced. This approach aims to enhance mass transfer and mitigate residual stress. First, an electrodeposition nozzle device was designed, and the liquid-phase mass transfer during electrodeposition was analyzed through finite element simulation. Simulation results indicate that the mass transfer coefficient increases with rising megasonic power density. Notably, when the megasonic power density reached 20 W/cm2, the mass transfer coefficient increased from 0.45 × 10-7 m/s to 18.63 × 10-7 m/s, compared to electrodeposition without megasonic agitation. Secondly, electrodeposition experiments were conducted both with and without megasonic assistance. X-ray diffraction (XRD) was employed to measure the residual stress values of the electrodeposited layers. The results reveal that samples processed with megasonic assistance exhibit lower residual stress values compared to those without. Specifically, at a megasonic power density of 10 W/cm2, the residual stress was 94.3 MPa, representing a 37.7 % reduction compared to the residual stress of 151.5 MPa observed in samples without megasonic agitation. Overall, the findings demonstrate that coaxial megasonic agitation can effectively enhance the liquid-phase mass transfer capability during electrodeposition and reduce the residual stress of the electroplated layer. This innovative method presents a promising avenue for improving electrodeposition processes and achieving superior material properties.
Study on Cleaning Effect of Different Water Flows on the Pulsed Cavitating Jet Nozzle

Chengting Liu,Gang Liu,Zuoxiu Yan

DOI: https://doi.org/10.1155/2019/1496594

IF: 1.616

2019-06-11

Shock and Vibration

Abstract:The method of cleaning by self-excited pulsed cavitating jet was proposed according to cleaning characteristics and requirements of large storage equipment. This method has many advantages compared with other cleaning methods. In order to achieve the optimum cleaning effects, experimental research on working status of the nozzle at different flow rates was conducted and analysis was carried out from the following four aspects: cavitation morphology, pressure pulse frequency, velocity fluctuation amplitude, and erosion effect. The research results showed that flushing effects in the nozzle without cavitation were far below those with cavitation; when the flow rate increased to over 2.7 m 3 /h, cavitation began to appear in the chamber. When Q = 7.2 m 3 /h, the velocity fluctuation amplitude was about 17.25 m and pressure fluctuation occurred for 86 times (maximum) within 1 s. During the experiment on erosion effects, the flow rate had little influence on outside diameter of the erosion circle. The erosion rate increased with the increase of the flow rate, reached the peak value at Q = 7.2 m 3 /h, but slightly decreased subsequently.
Enhancement of micro hole wetting and hydrogen bubble release in the process of Ni micro electroforming under megasonic field

Bingjiang Guo,Liqun Du,Shuai Wang,Xiaoke Cai,Aoqi Li,Zhongmin Wang

DOI: https://doi.org/10.1016/j.surfin.2023.103762

IF: 6.2

2023-12-16

Surfaces and Interfaces

Abstract:Micro hole wetting and hydrogen bubble release are two technical issues in the process of micro hole electroforming. A novel method of megasonic (1.7 MHz) field was introduced in order to solve the two problems and fabricate 20 μm micro column array in this paper. Micro electroforming experiments, capillary tube experiments, electrochemical experiments and testing of contact angle and surface tension coefficient were conducted without and with megasonic field. Experimental results indicated that megasonic field can promote micro hole wetting and bubbles release in the process of micro electroforming. 20 μm micro column array can be fabricated successfully under 2 W/cm 2 megasonic field. Because megasonic can decrease the contact angle between photoresist and electroforming solution, reduce the surface tension coefficient of electroforming solution and increase equilibrium potential of nickel. New mechanisms on enhancement of micro hole wetting and bubble release under megasonic field were revealed. The research provides a new comprehension of micro hole wetting and bubble release, which may be good for develop a new method to fabricate micro column array.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
Design and Development of a Novel Ultrasonic Field Wetting Angle Measuring Instrument for Researching the Wetting of the Liquid–Solid Interface

Jingtao Zhao,Liping Ning,Zongming Jiang,Yinglong Li

DOI: https://doi.org/10.3390/cryst11111400

IF: 2.7

2021-11-17

Crystals

Abstract:A key technical problem in the preparation of Al-Ti-C grain refiner and other composite materials is the poor wetting of the Al-C interface, which greatly restricts the development of the preparation technology of related composite materials. In view of this scientific challenge, a novel ultrasonic field wetting angle measuring instrument has been designed to research the wetting behavior of the liquid–solid interface and ensure that preparation conditions are optimized. The dimensional parameters of the ultrasonic transducer and the horn in the novel ultrasonic wetting angle measuring instrument have been designed by theoretical calculation, and the modal analysis was performed for the ultrasonic horn using the functions of displacement and time. Modal analysis was utilized to optimize the dimension of the ultrasonic horn, and the natural frequency of the longitudinal vibration of the horn was reduced from 22,130 Hz to 22,013 Hz, resulting in an error rate between the actual value (22,013 Hz) and the design value (20 kHz) of less than 1%. In addition, the influence of different transition arc radiuses on the maximum stress of the optimized ultrasonic horn was analyzed.

materials science, multidisciplinary,crystallography
Numerical and experimental study on cavitation enhancement of ultrasonic coupled abrasive jet polishing

Zhian Li,Jiangqin Ge,Xiao Li,Chen Li,Xi Zeng

DOI: https://doi.org/10.1007/s00170-024-13253-z

IF: 3.563

2024-03-05

The International Journal of Advanced Manufacturing Technology

Abstract:To enhance the effectiveness of jet polishing, ultrasonic coupled abrasive jet polishing (UC-AJP) was applied. Through high-frequency ultrasonic vibration, pressure lower than saturated vapor was generated in the jet. It made the jet medium cavitation; thus, cavitation-jet composite energy enhanced the material removal rate and reduced the roughness of the workpiece surface. Firstly, the principle of UC-AJP was analyzed, and a numerical model of UC-AJP was established according to the shear-stress transport (SST) k-ω turbulence model, Schnerr-Sauer cavitation model, and discrete phase model (DPM). Through the numerical calculation, the cavitation was enhanced with the increase of ultrasonic amplitude. When the amplitude reached 20 μm, the cavitation bubbles acted on the workpiece surface. Cavitation also increased the velocity and turbulent kinetic energy of the jet. Then, cavitation observation experiments were carried out; the results were consistent with the numerical simulation. Through the fixed-point polishing experiments, it was found that the erosion effect of UC-AJP on the workpiece was enhanced and then weakened. Through continuous polishing experiments, the surface of the workpiece was the smoothest after the polishing with amplitude 20 μm, the roughness decreased from 3.2 μm to 69 nm, and the speed of roughness reduction was also the fastest.

engineering, manufacturing,automation & control systems
Time-resolved monitoring of cavitation activity in megasonic cleaning systems

M Hauptmann,S Brems,H Struyf,P Mertens,M Heyns,S De Gendt,C Glorieux

DOI: https://doi.org/10.1063/1.3697710

Abstract:The occurrence of acoustic cavitation in the cleaning liquid is a crucial precondition for the performance of megasonic cleaning systems. Hence, a fundamental understanding of the impact of different parameters of the megasonic process on cavitation activity is necessary. A setup capable of synchronously measuring sonoluminescence and acoustic emission originating from acoustically active bubbles is presented. The system also includes a high-speed-stroboscopic Schlieren imaging system to directly visualize the influence of cavitation activity on the Schlieren contrast and resolvable bubbles. This allows a thorough characterization of the mutual interaction of cavitation bubbles with the sound field and with each other. Results obtained during continuous sonication of argon-saturated water at various nominal power densities indicate that acoustic cavitation occurs in a cyclic manner, during which periods of stable and inertial cavitation activity alternate. The occurrence of higher and ultraharmonics in the acoustic emission spectra is characteristic for the stable cavitation state. The inertial cavitation state is characterized by a strong attenuation of the sound field, the explosive growth of bubbles and the occurrence of broadband components in the acoustic spectra. Both states can only be sustained at sufficiently high intensities of the sound field. At lower intensities, their occurrences are limited to short, random bursts. Cleaning activity can be linked to the cavitation activity through the measurement of particle removal on standard 200 mm silicon wafers. It is found that the particle removal efficiency is reduced, when a continuous state of cavitation activity ceases to exist.
Experimental study on ship fouling cleaning by ultrasonic-enhanced submerged cavitation jet: A preliminary study

Xiao Zhong,Jingming Dong,Mushan Liu,Rongxuan Meng,Shuai Li,Xinxiang Pan

DOI: https://doi.org/10.1016/j.oceaneng.2022.111844

IF: 5

2022-08-15

Ocean Engineering

Abstract:Ship fouling is one of the essential factors that affect the economic benefits of the operational ships and the marine ecological environment. This will produce adverse effects such as increased energy consumption, increased carbon emissions, biological invasion, and hull damage. In this paper, a novel ultrasonic-enhanced submerged cavitation jet ship fouling cleaning method is proposed. The objective of this paper is to verify the feasibility of this method. A submerged cavitation jet experimental set-up was built. A mass loss method was used to evaluate the experimental results. The experimental results showed that the mass loss of samples increases greatly when the submerged cavitation jet combined with ultrasonic. This is preliminarily proved that the method of ultrasonic-enhanced submerged cavitation jet for cleaning the ship fouling is feasible. Under the pump pressures of 10 MPa and 20 MPa, the maximum mass loss of the samples were increased by 12.9% and 9.5%, respectively.

engineering, civil, ocean, marine,oceanography
An Experimental Study of the Nanoparticle Colloid Hydrodynamic Cavitation Jet Polishing Performance under Different Nozzle Designs

M. Zhou,Y. Zhang,Xing Wang,Fei-hu Zhang

DOI: https://doi.org/10.4028/www.scientific.net/AMR.325.633

2011-08-01

Abstract:Nanoparticle colloid hydrodynamic cavitation jet polishing (HCJP) is a super-smooth machining technology. This technology utilizes the interface reaction to remove material from the workpiece and uses cavitation effect to improve the processing efficiency. In this paper, the prototype equipment of HCJP is researched. Based on the prototype equipment, the processing experiments of pulsed jet nozzle, swirling jet nozzle and common cone-shaped nozzle have been done and the results of the experiments are compared with each other. The experiment results indicate that the roughness of the surfaces polished by three nozzles has remarkably decreased. The material removal rate of pulsed jet nozzle is the highest among the three types of nozzles. The material removal rate of the swirling jet nozzle is not improved obviously compared with the common cone-shaped nozzle. The processing experiment of monocrystalline silicon by the pulsed jet nozzle has been done and the roughness of processed surface is Ra 0.475 nm.

Engineering,Materials Science
Optimization of Si wafer chemical cleaning process

Zhizhen Ye,Xiaobo Jian,Jun Yuan,Jianguang Li

1996-01-01

Abstract:An experimental design method was used to optimize a chemical cleaning process of silicon wafers, and X-ray photoelectron spectroscopy (XPS) was used to measure the cleaned silicon surfaces. XPS survey spectra demonstrate that main impurities such as oxygen and carbon on the cleaned silicon surface reach an atomic cleanness level, oxygen atom content is 1.6��1013/cm2, carbon content is 3.1��1013/cm2 respectively. The influence of chemical solution on impurities at the cleaned silicon surfaces was investigated.
Experimental investigation of atomization characteristics of sonic blasting nozzle based on De-Laval dynamics

Xi Chen,Xiao Bai,Chaonan Fan,Shaocheng Ge,Cunbao Deng,Guoliang Ma

DOI: https://doi.org/10.1016/j.energy.2024.131188

IF: 9

2024-04-13

Energy

Abstract:The sonic boom atomization mechanism was applied to design a nozzle based on the Laval aerodynamics principle. The designed nozzle was simulated on the Fluent platform and the performance of the nozzles was evaluated on a test platform. The different parameters, including the flow characteristics, atomization characteristics, and dust reduction efficiency of the nozzle were analyzed under different air-water conditions. The obtained results show that under the same air and water pressure conditions, the size probability distribution peak, particle size distribution range, and median diameter of the droplet are smaller than those of an internal mixing nozzle. The sonic boom atomization nozzle consumes less water compared to traditional nozzles. After the installation of the sonic boom fog screen dust reduction system in the return air channel, the average values of total dust concentration and respiratory dust concentration were reduced by 91.26% and 90.16%, respectively. The obtained results indicate that sonic boom atomization nozzles can realize water saving and efficient dust reduction in underground coal mines.

energy & fuels,thermodynamics
Non-contact Post-CMP megasonic cleaning of cobalt wafers

Lifei Zhang,Xinchun Lu,Ahmed A. Busnaina

DOI: https://doi.org/10.1016/j.mssp.2022.107278

IF: 4.1

2023-01-01

Materials Science in Semiconductor Processing

Abstract:As feature size shrinks to 10 nm node and below, cobalt (Co) has been considered as one of the most promising replacements for both diffusion barrier layers as well as the copper conductive layer of interconnects. The cleaning process of Co films after chemical mechanical planarization (CMP) is vital to ensure the interconnection devices' yields and functionalities. This paper presents a study of non-contact megasonic cleaning approach for post-CMP cleaning of Co films. The research focuses on post-CMP megasonic cleaning with and without chem-istry to assess the effect of physical and chemical cleaning of Co films. We evaluate the effect of citric acid on the nanoparticle removal efficiency for Co films assisted with megasonic acoustic streaming. In terms of mechanical megasonic action, the acoustic streaming flow reduces the boundary layer thickness to less than one micron above the surface of the wafer, and that allows a high velocity within less than a micron boundary layer thickness applied the particles on the surface of the wafer. In chemical respect, the nanoparticle removal from Co surfaces can be attributed to the undercutting effect accelerated by complexation at low pH values, whereas the adsorption of citrate ions on Co oxide layers plays a critical role in alkaline regions. Moreover, the effects of megasonic parameters, including cleaning pressure amplitude (power), substrate exposure time, and cleaning tank flow rate on the nanoparticle removal efficiency have been investigated. The results show that the maximum cleaning efficiency of Co films with deionized water only yields 52.7% removal efficiency utilizing 66% power, 87 s cleaning time, and 1.1 GPM (gallons per minute) flow rate. When citric acid is utilized, a cleaning efficiency of similar to 99% or higher can be reached with 100% power, 59 s cleaning time, and 5 mM citric acid at pH 11. This demonstrates that both a cleaning chemistry and a physical cleaning force are both needed to achieve an effective post-CMP cleaning for Co films.
Exploring viscosity influence mechanisms on coating removal: Insights from single cavitation bubble behaviours in low-frequency ultrasonic settings

Hao Wu,Yongzhen Jin,Yuanyuan Li,Hao Zheng,Xiaochen Lai,Jiaming Ma,Claus-Dieter Ohl,Haixia Yu,Dachao Li

DOI: https://doi.org/10.1016/j.ultsonch.2024.106810

Abstract:The role of acoustic cavitation in various surface cleaning disciplines is important. However, the physical mechanisms underlying acoustic cavitation-induced surface cleansing are poorly understood. This is due to the combination of microscopic and ultrashort timescales associated with the dynamics of acoustic cavitation bubbles. Here, we have precisely controlled single-bubble cavitation in both space and time. Ultrasonic excitation leads to the cavitation of generated single bubbles. A synchronous ultrafast photomicrographic system simultaneously records the dynamics of single acoustic cavitation bubbles (SACBs) and the cleaning process of the nearby surface in liquids with varying viscosities. Finally, we analysed the correlation between bubble dynamics and surface cleaning situations. The differences in the typical dynamic characteristics of the bubbles during collapse in liquids with varying viscosities reveal two main mechanisms underlying surface cleaning by acoustic cavitation, which are respective the Laplace pressure during the bubble's movement and liquid jets during bubble collapse. Our study provides a better physical understanding of the ultrasonic cleaning process based on acoustic cavitation, and will help to optimize and facilitate the applications of surface cleaning, especially for the cleaning of substrates with tightly attached dirt.
Slim Water Injection Nozzle for Silicon Wafer Wet Cleaning Bath

Hitoshi Habuka,Shogo Okuyama,A. Goto,Kento Miyazaki,N. Ono

DOI: https://doi.org/10.4236/ACES.2016.64035

2016-08-15

Abstract:In order to effectively and quickly clean the surface of semiconductor silicon wafers, the fluid flow is one of the significant issues. For a batch-type silicon wafer wet cleaning bath, a slim water injection nozzle consisting of a dual tube was studied, based on theoretical calculations and experiments. A thin inner tube was placed at the optimum position in the water injection nozzle. Such a simple design could make the water injection direction normal and the water velocity profile symmetrical along the nozzle. The water flow in the wet cleaning bath was observed using a blue- colored ink tracer. When the nozzle developed in this study was placed at the bottom of the bath, a fast and symmetrical upward water stream was formed between and around the wafers.

Materials Science,Engineering,Chemistry
Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing

Linzheng Ye,Jialong Wu,Xijing Zhu,Yao Liu,Wenlong Li,Shida Chuai,Zexiao Wang

DOI: https://doi.org/10.1038/s41598-024-77598-x

IF: 4.6

2024-10-31

Scientific Reports

Abstract:Silicon carbide (SiC) is renowned for its exceptional hardness, thermal conductivity, chemical stability, and wear resistance. However, the existing process is difficult to meet the high standards of uniform corrosion in its polishing process and surface roughness and flatness after polishing, new polishing fluids and technique optimization are crucial for development. The study optimized and validated the composition of the polishing fluid used in ultrasonic-assisted chemical-mechanical polishing (UACMP). Abrasives significantly influenced the material removal rate (MRR) and surface roughness (Ra), contributing 67.63% and 56.43%, respectively. Organic bases and pH buffers significantly affected Ra, accounting for 19.66% and 21.44%, respectively. The optimum composition was determined, consisting of triethylamine (3wt%), potassium hydrogen phthalate (1wt%), a composite of silica and alumina abrasive particles (5wt%), and hydrogen peroxide (6wt%), which reduced the Ra from 95 nm to 3 nm. The MRR achieved 25.96 nm/min. In comparison to the 7 nm minimum roughness from the orthogonal test, the optimal scheme's Ra was reduced by 57.14%, leading to a significant enhancement in overall surface quality. In this paper, a new type of additive is added to prepare the polishing liquid, which provides a new idea for the UACMP of SiC and has a great impact.

multidisciplinary sciences
Surface topography by water jet-guided laser texturing on wettability of monocrystalline silicon

Yinuo Zhang,Hongchao Qiao,Jibin Zhao,Zhihe Cao

DOI: https://doi.org/10.1007/s00170-022-08712-4

IF: 3.563

2022-02-26

The International Journal of Advanced Manufacturing Technology

Abstract:At present, the use of microstructure to change the optical properties and wetting properties of the material itself has become the main means to improve the utilization rate of materials in the manufacturing industry. Due to the hydrophilicity of the material surface can achieve underwater self-cleaning, directional transportation function, it becomes an indispensable part of surface modification. Water jet-guide laser processing can significantly reduce the formation of the heat-affected zone and crack, and can clearly ablate the material, with higher precision and resolution. In this experiment, the effects of scan spacing, laser output power and channel aspect ratio are examined and processing conditions for achieving near superhydrophilicity are provided. Owing to the anaerobic processing environment, the surface chemical composition of the material does not change, and the hydrophilicity is increased by 8% to 43% compared with that before. Increasing the aspect ratio can increase the wettability, when the aspect ratio is more than 1.63, the wettability begins to rebound, and the wettability becomes worse. Using small laser power and multiple scanning processing scheme can make the surface covered with tiny small pillars of micro-nano particles layer beneficial to increase the droplet adhesion, and the minimum contact angle can reach 37.2°.

engineering, manufacturing,automation & control systems

Study of Single-wafer Megasonic Cleaning and Optimization of Megasonic Nozzle

Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing

Study on the processing mechanism of two-dimensional ultrasonic polishing without abrasives

Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming

An Experimental Study of Atomization Characteristics of the Ultrasonic Spray Nozzle

Study of Anisotropic Etching of (100) Si with Ultrasonic Agitation

Study of liquid-phase mass transfer and residual stress in jet electrodeposition process with coaxial megasonic agitation

Study on Cleaning Effect of Different Water Flows on the Pulsed Cavitating Jet Nozzle

Enhancement of micro hole wetting and hydrogen bubble release in the process of Ni micro electroforming under megasonic field

Design and Development of a Novel Ultrasonic Field Wetting Angle Measuring Instrument for Researching the Wetting of the Liquid–Solid Interface

Numerical and experimental study on cavitation enhancement of ultrasonic coupled abrasive jet polishing

Time-resolved monitoring of cavitation activity in megasonic cleaning systems

Experimental study on ship fouling cleaning by ultrasonic-enhanced submerged cavitation jet: A preliminary study

An Experimental Study of the Nanoparticle Colloid Hydrodynamic Cavitation Jet Polishing Performance under Different Nozzle Designs

Optimization of Si wafer chemical cleaning process

Experimental investigation of atomization characteristics of sonic blasting nozzle based on De-Laval dynamics

Non-contact Post-CMP megasonic cleaning of cobalt wafers

Exploring viscosity influence mechanisms on coating removal: Insights from single cavitation bubble behaviours in low-frequency ultrasonic settings

Slim Water Injection Nozzle for Silicon Wafer Wet Cleaning Bath

Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing

Surface topography by water jet-guided laser texturing on wettability of monocrystalline silicon