Phase Reactions and Diffusion Path of the SiC/Cr System

M. Naka,J. C. Feng,J. C. Schuster
DOI: https://doi.org/10.1023/A:1022617502576
1998-01-01
Journal of Materials Synthesis and Processing
Abstract:Solid-state bonding at pressureless-sintered SiC has been carried out using 25-μm Cr foil at temperatures from 1373 to 1773 K for 1.8 ks in vacuum. The formation of reaction phases and microstructures at the interface between SiC and Cr was investigated by X-ray diffraction and microprobe analysis. At the bonding temperature of 1373 K the cubic Cr 23 C 6 phase formed next to Cr, and the hexagonal Cr 7 C 3 phase formed next to SiC. At 1473 K the cubic phase Cr 3 SiC x appeared additionally on the SiC side. At 1573 K the complete diffusion path was established. Upon increasing the joining temperature beyond 1573 K all the chromium was consumed, and Cr 23 C 6 and Cr 3 SiC x dissolved. A layered structure consisting of SiC/Cr 5 Si 3 C x /Cr 7 C 3 /Cr 5 Si 3 C x /SiC occurred.
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