A FCOB packaged thermal wind sensor with compensation

Guang-Ping Shen,Ming Qin,Qing-An Huang,Hua Zhang,Jian Wu
DOI: https://doi.org/10.1007/s00542-010-1026-8
2010-01-01
Microsystem Technologies
Abstract:A two dimensional wind sensor was designed, fabricated and packaged on ceramic substrate instead of silicon substrate. The Ti/Pt heater and thermistors were fabricated using single lift-off process. The gold bumps were then sputtered and patterned on the chip using lift-off process again. Correspondingly, the Pb/Sn bumps were fabricated on the FR4 substrate using stencil printing method after metallization. The sensor chip was flip-chip packaged on the FR4 substrate, and the gap was filled with epoxy-based underfill to improve the structure strength. The packaged sensor was tested in wind tunnel in constant power mode. The wind velocity and direction offsets of the sensor were compensated using software and hardware calibration. Both the simulation and test results show that the thermal wind sensor can measure wind speeds up to 8 m/s with an accuracy of 0.3 m/s, and wind direction in a full range of 360° with a resolution within 5°.
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