Fabrication of CNTs/Cu Composite Thin Films for Interconnects Application

Ping Liu,Dong Xu,Zijiong Li,Bo Zhao,Eric Siu-Wai Kong,Yafei Zhang
DOI: https://doi.org/10.1016/j.mee.2008.04.046
IF: 2.3
2008-01-01
Microelectronic Engineering
Abstract:Carbon nanotubes/copper (CNTs/Cu) composite thin films were fabricated by combined electrophoresis and electroplating techniques. Electrical properties and structure of both CNTs/Cu thin films and the reference pure Cu thin films were investigated after annealing at different temperatures. The sheet electrical resistance of CNTs/Cu films decreases faster than that of pure Cu films with increase of annealing temperature. The grain size of CNTs/Cu film becomes much larger than that of pure Cu film at the same annealing temperature. The peak relative intensity of Cu (111) plane in CNTs/Cu film was stronger than that of pure Cu film. CNTs/Cu composite thin films, with better electrical properties than that of conventional pure Cu thin films, have been fabricated by electrophoresis and electroplating deposition techniques.
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