Influence of oxygen precipitates on the warpage of annealed silicon wafers

Deren Yang,Gan Wang,Jin Xu,Dongsheng Li,Duanlin Que,C. Funke,H. J. Moeller
DOI: https://doi.org/10.1016/S0167-9317(02)00940-1
IF: 2.3
2003-01-01
Microelectronic Engineering
Abstract:The warpage of conventional Czochralski (CZ) and nitrogen-doped Czochralski silicon (NCZ) wafers with similar oxygen concentration were investigated. In the experiments, a two-step annealing process was taken to generate oxygen precipitates. After the elevated temperature annealing, no obvious warpage in both the CZ and NCZ silicon wafers was found, even'if nitrogen was found to enhance oxygen precipitation and the stronger internal stresses were detected at the edge and center of an annealed wafer. It is considered that oxygen precipitates with relatively smaller sizes were successful in preventing the warpage of the silicon wafers, which is mainly dependent on thermal stress, because the oxygen precipitates can pin dislocations.
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