Abstract:High frequency signals propagate along the edges of conductors. If the conductors are electroplated, then the seed layer forms at least one edge, so care must be taken to insure the electrical quality of these layers. In this work, we study the initial quality of SAM-based seed layers that are compatible with complex surfaces including through-silicon vias (TSVs), as are used in via-last three-dimensional semiconductor device packaging. The conformal and electrical quality of the seed metal is very important. Also important for a multifunction seed layer is its ability as a barrier layer, which protects the substrate from high temperature diffusion of the deposited metal. Thus, the barrier layer must be robust enough to withstand diffusion, yet thin enough to provide a conformal surface that allows metal seed layer deposition. Standard barrier layer deposition methods such as evaporation or sputtering require either a line of sight from the source or aspect ratios large enough to provide scattering from the background gas within the structure to coat all surfaces. Electrochemical and chemical vapor deposition provide alternatives, but concerns arise about contamination and compatibility with radio frequency or high-speed digital signals. We propose a barrier layer based on an aromatic self-assembled monolayer (SAM) for use in electroless copper seed layer deposition. The viability of the SAM barrier layer is determined by the quality of the deposited copper seed film, judged quantitatively by thin film resistivity and qualitatively by surface adhesion and morphological properties such as cracks and bubbles. Insights to the origins of problems and an optimal scheme are described. Extensions for use as a photolithographic resist layer are suggested. Our SAM approach for TSV applications yields a 'smart' seed layer that can be used with a 'simple,' scalloped, easy to fabricate, via hole.

New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process

Developing A Well-Adhered Ni/P Alloy Film On The Surface Of Silicone Elastomer For Shielding Electromagnetic Interferences

Electroless Ni–Mo–P Diffusion Barriers with Pd-activated Self-Assembled Monolayer on SiO2

Electroless Nimop Thin Film Deposition On Si/Sio2

Growing process and reaction mechanism of electroless Ni-Mo-P film on SiO_2 substrate

Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technology

Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process

Heterogeneous Bonding with Nanostructured Silver Langmuir-Blodgett Film

Exploitation of a Self-Limiting Process for Reproducible Formation of Ultrathin Ni1−xPtx Silicide Films

Microstructural evolution of wet deposited nickel interfacial phases on phosphorus doped silicon surface

Exploring the fabrication and transfer mechanism of metallic nanostructures on carbon nanomembranes via focused electron beam induced processing

Self-assembly of organic monolayers as protective and conductive bridges for nanometric surface-mount applications

Epitaxy of Ultrathin Nisi2 Films with Predetermined Thickness

Study on Electroless Deposition Nimop Layer by Sam

Electroless Plating Ni-based Barrier Layers for Silicon Vertical Interconnects

Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors

Selective Atomic Layer Deposition to Extend Moore’s Law and Beyond: Surface Kinetic Tuning for Self-Aligned Growth

Interfacial Design and Functionization on Metal Electrodes Through Self-Assembled Monolayers

A barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films

Electrochemical study and structural comparison of Ni electrodepositions on W/Si and Cr/C multilayered structure films

A New Activation Method For Electroless Metal Plating: Palladium Laden Via Bonding With Self-Assembly Monolayers