Abstract:Thermal management materials with high thermal conductivity (TC), adjustable coefficient of thermal expansion (CTE) and excellent mechanical properties have promising applications in the electronic packaging and high-power density equipment fields. In this work, we have developed a novel strategy for tungsten-copper coated graphite flakes and aluminum nitride nanoparticles reinforced copper matrix composites (GFs(W–Cu)/AlN/Cu composites) fabricated by vacuum hot-pressing sintering. Herein, tungsten-copper coated graphite flakes (GFs(W–Cu)) were prepared by impregnation reduction and ultrasonic-assisted electroless plating, in which W–Cu coating improved interfacial bonding and realized metallurgical-physical synergy. Meanwhile, the AlN nanoparticles reinforced Cu flakes (AlN/Cu) were prepared by high energy ball milling, where AlN nanoparticles were evenly dispersed in the Cu matrix and played the role of pinning boundary and refining grain. Effects of nano-AlN with different volume fractions on the mechanical and thermal properties of GFs(W–Cu)/AlN/Cu composites were studied as well. As for the mechanical properties, the in-plane, through-plane flexural strength and tensile strength of GFs(W–Cu)/1.5AlN/Cu composite reached 276.7 ± 4.5, 390.6 ± 4.5 and 136.1 ± 3.0 MPa respectively, which increased by 96.8%, 283.7% and 120.7% than those of the GFs(W–Cu)/Cu composites. In terms of the thermal properties, the in-plane TC of GFs(W–Cu)/1.5AlN/Cu composite is 617.8 ± 12 Wm−1K−1, while the through-plane CTE ranging 25–200 °C is 4.9 ± 0.2 ppmK-1. In conclusion, the GFs(W–Cu)/AlN/Cu composites provide a huge potential for design and application in the thermal management materials.

Improvement of thermal management capability of AlN coatings via adjusting nitrogen pressure

AlN coatings with high thermal conductivity and excellent electrical properties for thermal management devices

Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling

Preparation of AlN microspheres/UHMWPE composites for insulating thermal conductors

Experimental Observation of High Intrinsic Thermal Conductivity of AlN

High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature

Balancing thermal conductivity and strength of hot-pressed AlN ceramics via pre-sintering and annealing process

The quantitative investigation of the lattice oxygen and grain edge oxygen on the thermal conductivity of aluminum nitride ceramics

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Effect of nitrogen pressure on the microstructure, mechanical and electrochemical properties of CrAlN coatings deposited by filter cathode vacuum arc

Research Progress of Alumina Nitride Ceramics with High Thermal Conductivity

High-Thermal-Conductivity AlN Ceramics Prepared from Octyltrichlorosilane-Modified AlN Powder

Investigation on the Microstructure and High-Temperature Properties of AlN Coating Through Oxygen Addition

Synergistic enhancing effect of tungsten-copper coated graphite flakes and aluminum nitride nanoparticles on microstructure, mechanical and thermal properties of copper matrix composites

Low temperature cofired and multilayer substrates

Effect of AlN Addition on Phase Formation in the LTCC with Al2O3/AlN Biphasic Ceramics Based on BBSZ Glass

Additive manufacturing of complex-shaped and high-performance aluminum nitride-based components for thermal management

Effect of nitrogen pressure on the fabrication of AlCrFeCoNiCu0.5 high entropy nitride thin films via cathodic arc deposition

Enhanced thermal conductivity and mechanical performance of CaO–B2O3–SiO2 glass ceramic with AlN addition for LTCC applications

General Approach to Hydrolysis Resistive Aluminum Nitride and Its High-Performance Thermal Interface Materials

Rapid fabrication of surface microstructures on AlN HTCC substrate by chemically assisted laser ablation