Abstract:Weakly binding organic species have been shown to significantly impact electrocatalytic activities of metal surfaces, however, molecular level mechanisms remain elusive. The ambiguity of whether these weakly binding species are specifically adsorbed is a key challenge as there are few experimental techniques with sufficient sensitivity. Vibrational Stark effect of interfacial species offers a feasible way to achieve this goal with vibrational spectroscopies, such as surface enhanced infrared absorption spectroscopy (SEIRAS) and surface enhanced Raman spectroscopy (SERS). In this work, we employed a library of bifunctional molecules with an isocyano group designed to anchor on the Au surface and an unbound cyano or isocyano group, to investigate the effect of variations in the electric field on the Stark tuning rate of both functional groups. Surface bound isocyano group shows pronounced Stark tuning rates (2.4-4.7 cm-1/(MV/cm)) while the Stark tuning rates of the free functional groups is comparable to or below the spectral resolution (< 0.6 cm-1/(MV/cm)). Contributions from variations in the bond force constant, induced by electric field or Fermi level shift, and the anharmonicity effect to the observed Stark tuning rates were deconvoluted. Shift in the vibrational peak of specifically adsorbed functional group is more sensitive to the change in the electrode potential, which could be used to identify surface adsorbates at electrochemical interfaces. Our results suggest that Stark tuning rates above 0.6 cm-1/(MV/cm) can be considered as strong evidence for specific adsorption on the electrode surface.

Uncovering the Dissociative Adsorption of the Leveler Janus Green B on Cu Electrodes at the Molecular Level

In Situ Wide-Frequency Surface-Enhanced Infrared Absorption Spectroscopy Enables One to Decipher the Interfacial Structure of a Cu Plating Additive

Quantum Chemical Calculations and Molecular Dynamics Simulations to Investigate the Mechanism of Interaction of Six Dye Levelers with Copper Surface

Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

Adsorption of divalent heavy metal ions onto IDA-chelating resins: simulation of physicochemical structures and elucidation of interaction mechanisms.

Atr Ftir Study of Levellers for Cu Electrodeposition from Acidic Sulphate Solution

Electrochemical Behaviors of Janus Green B in Through-Hole Copper Electroplating: an Insight by Experiment and Density Functional Theory Calculation Using Safranine T As a Comparison

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth

Understanding the Effect of Specific Adsorption on Vibrational Stark Effect of Adsorbates on Electrode Surface via Surface Enhanced Spectroscopies

Adsorption Performances for Aqueous Cu(II) onto Chelating Resin Dowex M-4195: Interaction Mechanism Investigation

Quinacridone skeleton as a promising efficient leveler for smooth and conformal copper electrodeposition

Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating

Unveiling the Potential and Mechanisms of 3,3'-Bicarbazole-Based Quaternary Ammonium Salts as Levelers

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition

Revisiting the Polyethylene Glycol-Chloride Adsorption Structure on Cu Electrode in Sulfuric Acid Solution by Wide-Frequency ATR-SEIRAS

Effect of Nitrogen-containing Groups on the Reduction of Copper Ions: in Situ Raman and AIMD

Synthesis and Application of Anthraquinone Quaternary Phosphonium Salt Electroplating Copper Leveler Based on Expanded Electrostatic Adsorption Area Strategy and Physicochemical Salt Bridge Mechanism

Synthesis of Quinacridone Derivatives and Their Application As High Performance Levelers in Electroplating

Engineering Aromatic Heterocycle Strategy: Improving Copper Electrodeposition Performance Via Tuning the Bandgap of Diketopyrrolopyrrole-Based Leveler

Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations