Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition

Jun Li,Jie Xu,Xiaomin Wang,Xiaochuan Wei,Limin Wang

DOI: https://doi.org/10.1016/j.apsusc.2021.150982

IF: 6.7

2021-12-01

Applied Surface Science

Abstract:Diketopyrrolopyrrole (DPP) quaternary ammonium compound is an excellent leveler for the copper electrodeposition. Herein, we propose a supramolecular nano-leveler based on DPP molecule, which is composed of a symmetrical amphiphilic molecule of bipyridinium (Bpy) units grafted on DPP skeleton and assembled with cucurbit[7]uril (CB[7]). Compared with unassembled levelers, this supramolecular leveler shows significant advantages in achieving conformal copper electrodeposition. DFT calculations and molecular dynamics simulations demonstrate that the CB[7] assembled strategy can increase the charge density of nano-leveler and lead to the strong adsorption on the surface of substrate, thus efficiently regulating the copper deposition process. As a result, the solution implement of 2 μmol/L nano-leveler and other additives achieves excellent bottom-up filling performance, accompanying by a high filling efficiency of 97.7%. This supramolecular assembled strategy of leveler may open up a new avenue for the interfaces engineering of organics for semiconductor fabrication.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films