Abstract:Leveler is one of the most important additives for super-conformal copper electroplating, which has been widely applied in the fabrication of nanoscale (or microscale) interconnect features in integrated circuits (ICs) and printed circuit boards (PCBs). Because the structure-property relationship of the leveler is not clear, the development of novel leveler with high microvia filling performance is very time-consuming and challenging. In this study, a series of triphenylmethane-based (TPM-based) molecules with different nitrogen-containing groups have been designed, synthesized, and investigated as novel levelers for super-conformal copper electroplating. Their structure-property relationships are investigated by electrochemical analyses, contact angle measurements, and microvia filling electroplating experiments. It is found that the steric hindrance and the type of the nitrogen-containing groups (tertiary amine or quaternary ammonium with counter anions) in a leveler not only affect its adsorption ratio and strength on the copper interface, but also affect its adsorption preference on different copper crystalline plane. In combination with Cl−, polyethylene glycol (PEG, suppressor), and bis-(3-sulfopropyl) disulfide (SPS, accelerator), all TPM-based levelers show excellent microvia filling performances in copper electroplating and their effective concentrations are related to their antagonistic ability against the accelerator SPS.

Engineering Aromatic Heterocycle Strategy: Improving Copper Electrodeposition Performance Via Tuning the Bandgap of Diketopyrrolopyrrole-Based Leveler

Aryl Modification of Diketopyrrolopyrrole-Based Quaternary Ammonium Salts and Their Applications in Copper Electrodeposition

Synthesis and mechanism of quaternary ammonium salts based on porphyrin as high-performance copper levelers

Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition

Novel 2,5-bis(6-(trimethylamonium)hexyl)-3,6-diaryl-1,4-diketopyrrolo[3,4-c]pyrrole pigments as levelers for efficient electroplating applications

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Investigation of Synthesized Carbazole Derivative Cz-BPDB As a High-Performance Leveler for Copper Electroplating

Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating.

Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects

Synthesis of Quinacridone Derivatives and Their Application As High Performance Levelers in Electroplating

Synthesis of coplanar quaternary ammonium salts with excellent electrochemical properties based on an anthraquinone skeleton and their application in copper plating

Quinacridone skeleton as a promising efficient leveler for smooth and conformal copper electrodeposition

Investigation on Synthesis and Mechanism of a Sudan Ⅰ Copper Electrodeposition Leveler Based on Influencing Ion Diffusion Strategy

Synthesis and Application of Anthraquinone Quaternary Phosphonium Salt Electroplating Copper Leveler Based on Expanded Electrostatic Adsorption Area Strategy and Physicochemical Salt Bridge Mechanism

5-Amino-1,3,4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies

Unveiling the Potential and Mechanisms of 3,3'-Bicarbazole-Based Quaternary Ammonium Salts as Levelers

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating

Effect of Nitrogen-containing Groups on the Reduction of Copper Ions: in Situ Raman and AIMD

Interface Adhesion Enhancement by Condensed Aromatic Ring Expansion of Naphthalene Imide Derivatives for Microvia Metallization by Copper Electroplating

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth