Abstract:The surface modification by ultra-fast laser could regulate the mechanical properties of hard and brittle materials. Since silicon carbide (SiC) is too hard to be machined with acceptable removal rate and quality by mechanical abrasives, and femtosecond laser (fs-laser) assisted grinding could be a potential method to improve the machinability of SiC. Under fs-laser modulating, SiC surface could be modified to generate laser-induced periodic surface structures (LIPSS). Understanding the mechanical properties and material removal mechanism of the LIPPS surface is crucial to accomplish a high efficiency and quality machining process. This paper aims to investigate the effects of fs-laser modification on the mechanical properties, removal mechanism, removal efficiency, and microstructure changes of 4H-SiC surface during removal, together with those of the original 4H-SiC surface for comparison. The hardness and elastic recovery ability of the modified layer are determined by nanoindentation test, and the nano-scratch test is adopted to study the materials removal behavior. The removal efficiency and the quality of the modified surface is significantly improved. Phase transformation is observed in the scratching area, which reveals the existence of ductile mode removal. Moreover, the stress distribution and the change of scratching force on the surface of SiC before and after modification are studied by finite element method (FEM). The results show that the stress distribution and transmission when scratched on the modified surface is lower than that of the original surface, and the scratching force under the same scratch conditions is greatly reduced. With the understanding of materials removal behavior from the whole process of deformation, phase transformation, and separation of LIPPS from substrate, then the fs-laser modification of SiC could be evidenced as an effective method to improve the grinding efficiency and quality in mass production of industry.

Femtosecond laser surface modification coupling with surface metallurgical reaction promotes surface plasticity of SiC

Femtosecond laser surface modification of 4H-SiC improves machinability

Femtosecond Laser Modification of Silicon Carbide to Improve the Materials Removal Efficiency

Materials removal mechanism of single crystalline SiC with laser-induced periodic surface structures (LIPSS)

Experimental and Simulation Research on Femtosecond Laser Induced Controllable Morphology of Monocrystalline SiC

Study on the surface layer formation of aluminum matrix composites and associated machinability in precision milling based on laser melting modification

Femtosecond laser modification of silicon carbide substrates and its influence on CMP process

Influence of surface morphology on processing of C/SiC composites via femtosecond laser

The ablation behavior and modification mechanism of SiC under different laser energy

Experimental and MD simulation study of surface residual stress and surface quality of SiCp/Al in pulsed laser-ultrasonic assisted grinding

Study of Femtosecond Laser Ablation and Polishing Process on 4H-SiC Substrate

Investigation on the impact of thermal softening effect induced by nanosecond pulsed laser-assisted cutting on the deformation mechanism of SiCp/Al composites

One-step fabrication of fine surfaces via femtosecond laser on sliced SiC

Defect Suppression Mechanism for Laser In-Situ Assisted Diamond Cutting of Reaction-Bonded Silicon Carbide

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Surface modulation to enhance chemical mechanical polishing performance of sliced silicon carbide Si-face

Surface Modification of Single-Crystal Silicon by Hybrid Laser Treatment

Centimeter-scale low-damage micromachining on single-crystal 4H–SiC substrates using a femtosecond laser with square-shaped Flat-Top focus spots

Character and Mechanism of Surface Micromachining for C/SiC Composites by Ultrashort Plus Laser

Investigation of the Material Removal Process in In-Situ Laser-Assisted Diamond Cutting of Reaction-Bonded Silicon Carbide

Investigation on femtosecond laser combined with dynamic wet etching machining of SiC/SiC