The effect of low-energy ion-implantation on the electrical transport properties of Si-SiO2 MOSFETs

D. R. McCamey,M. Francis,J. C. McCallum,A. R. Hamilton,A. D. Greentree,R. G. Clark
DOI: https://doi.org/10.48550/arXiv.cond-mat/0411185
2004-11-08
Materials Science
Abstract:Using silicon MOSFETs with thin (5nm) thermally grown SiO2 gate dielectrics, we characterize the density of electrically active traps at low-temperature after 16keV phosphorus ion-implantation through the oxide. We find that, after rapid thermal annealing at 1000oC for 5 seconds, each implanted P ion contributes an additional 0.08 plus/minus 0.03 electrically active traps, whilst no increase in the number of traps is seen for comparable silicon implants. This result shows that the additional traps are ionized P donors, and not damage due to the implantation process. We also find, using the room temperature threshold voltage shift, that the electrical activation of donors at an implant density of 2x10^12 cm^-2 is ~100%.
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