Design and High-Frequency Characterization of a Wafer-Scale Vertical Bridge Structure Nanoscale Vacuum Electronic Device

Ruihan Huang,Feiliang Chen,Junxiang Yang,Haiquan Zhao,Yazhou Wei,Xiangdong Wang,Hao Jiang,Fan Yang,Yang Liu,Mo Li,Jian Zhang
DOI: https://doi.org/10.1109/ted.2024.3382648
IF: 3.1
2024-04-27
IEEE Transactions on Electron Devices
Abstract:A novel two-terminal vertical bridge structure nanoscale vacuum electronic device (NVED) is proposed to optimize the device structure for improved frequency characteristics in this study. By introducing a bridge structure, the sacrificial layers used for supporting between the electrodes are completely released, resulting in suspended electrodes. This successful implementation has significantly reduced the interelectrode capacitance to a level comparable to that of planar lateral devices. As a result, the frequency characteristics of the vertical structure device have been greatly enhanced. The fabrication of this device is obtained by a combination of atomic layer deposition (ALD) and buffered oxide etching (BOE), which is compatible with the CMOS process. The emission characteristics of the fabricated device under atmospheric conditions are measured with excellent stability and repeatability. More importantly, for the first time, the scattering parameters of the NVED have been measured under 0-V bias conditions within a frequency range of 10 MHz–10 GHz. A high-frequency small-signal model has also been established and validated against the measured parameters, demonstrating good consistency over the entire frequency range. Ultimately, the study successfully validates the frequency conversion functionality of the proposed NVED. These results highlight the potential of the device for operation in the high-frequency range, which is particularly significant in communication and radar applications.
engineering, electrical & electronic,physics, applied
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