Plasma-enhanced atomic layer deposition of titanium nitride for superconducting devices

John Femi-Oyetoro,Sasha Sypkens,Henry LeDuc,Matthew Dickie,Andrew Beyer,Peter Day,Frank Greer
2023-12-16
Abstract:This study presents a comprehensive investigation into the exceptional superconducting attributes of titanium nitride (TiN) achieved through plasma-enhanced atomic layer deposition (PEALD) on both planar and intricate three-dimensional (3D) structures. We introduced an additional substrate biasing cycle to densify the film and remove ligand residues, augmenting the properties while minimizing impurities. While reactive-sputtered TiN films exhibit high quality, our technique ensures superior uniformity by consistently maintaining a desired sheet resistance greater than 95 percent across a 6inch wafer, a critical aspect for fabricating extensive arrays of superconducting devices and optimizing wafer yield. Moreover, our films demonstrate exceptional similarity to conventional reactive-sputtered films, consistently reaching a critical temperature (Tc) of 4.35 K with a thickness of around 40 nm. This marks a notable achievement compared to previously reported ALD-based superconducting TiN. Using the same process as for planar films, we obtained Tc for aspect ratios (ARs) ranging from 2 to 40, observing a Tc of approximately 2 K for ARs between 2 and 10.5. We elucidate the mechanisms contributing to the limitations and degradation of superconducting properties over these aggressive 3D structures. Our results seamlessly align with both current and next-generation superconducting technologies, meeting stringent criteria for thin-film constraints, large-scale deposition, conformality, 3D integration schemes, and yield optimization.
Superconductivity,Materials Science
What problem does this paper attempt to address?
The paper aims to address the issue of preparing titanium nitride (TiN) films on planar and complex 3D structures using plasma-enhanced atomic layer deposition (PEALD) technology to achieve their excellent superconducting properties. Specifically, the researchers introduced an additional substrate bias cycle to increase the film density and remove ligand residues, thereby improving film quality and reducing impurities. This technique ensures that the film has over 95% uniformity on 6-inch wafers, which is crucial for manufacturing large-scale superconducting device arrays and optimizing wafer yield. Furthermore, the study also explores the limitations and degradation mechanisms of superconducting performance when depositing TiN films in 3D structures with high aspect ratios (ARs). These findings are significant for current and next-generation superconducting technologies, particularly in meeting the stringent requirements of thin layer constraints, large-scale deposition, conformality, 3D integration schemes, and yield optimization. In summary, the study successfully achieved high-quality TiN film deposition in complex 3D structures by optimizing the PEALD process, which is a significant advancement for the development of superconducting devices.