Adiabatic Joule Heating of Copper from 4 K to the Melting Temperature

Alain Guillet,Fabrice Delamarre

DOI: https://doi.org/10.48550/arXiv.1503.01279

2015-03-04

Abstract:Considering a copper wire heated by Joule effect and the variation of its resistivity and specific heat with temperature, we established numerical and analytical solutions (between 293 and 1356 K for the latter) for the evolution of its temperature over time. The Temperature vs. Time evolution follows a Lambertian function. The calculations are based on the assumption of adiabatic heating and uniform current distribution within the wire. We demonstrate that at very low temperature the heating rate is strongly dependent on copper purity.

Materials Science

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the accurate description of the temperature change of copper wires over time during the heating process via the Joule effect. Specifically, the researchers focused on the temperature evolution process of copper wires under high current densities at different initial temperatures (4 K, 77 K, and 293 K), especially under adiabatic conditions (i.e., assuming no heat loss to the surrounding environment). The focus of the study was to consider the influence of the changes in material properties (such as resistivity \(\rho(T)\) and specific heat \(C_p(T)\)) with temperature on the heating rate.

To achieve this goal, the researchers first solved the differential equation (Equation 1) describing the temperature change over time by numerical methods, and then attempted to find an analytical solution under specific conditions (\(T_0 > 293\) K). They found that at very low temperatures, the heating rate strongly depends on the purity of copper, indicating that impurities have a significant impact on the thermal behavior at low temperatures. In addition, the study also showed the specific laws of the specific heat and resistivity of copper changing with temperature in the temperature range from 4 K to the melting point of copper. These laws are crucial for understanding and predicting the thermal behavior of copper under high current densities.

The key formulas used in the study include:

1. The basic energy balance equation describing the temperature change over time:
\[
\frac{dT}{dt} = \frac{J^2 \rho(T)}{D C_p(T)}
\]

2. Considering the form of the analytical solution with the change of material properties with temperature, the final relationship between temperature and time can be expressed as:
\[
T(K) = 293 + \frac{1}{\alpha} \left[ \exp\left( \frac{\alpha^2 M \rho_{293K}}{3 R D} J^2 t \right) - 1 \right]
\]

Here, \(J\) is the current density, \(\rho(T)\) is the resistivity, \(D\) is the material density, \(C_p(T)\) is the specific heat, \(M\) is the atomic mass, \(R\) is the gas constant, and \(\alpha\) and \(\beta\) are temperature - related coefficients. These formulas and analysis results are helpful for in - depth understanding of the thermal behavior of copper under high current densities and are of great significance for materials science and engineering applications.