High-performance thermoelectric properties of Cu 2 Se fabricated via cold sintering process

Piyawat Piyasin,Dulyawich Palaporn,Ken Kurosaki,Supree Pinitsoontorn

DOI: https://doi.org/10.1016/j.solidstatesciences.2024.107448

IF: 3.752

2024-01-19

Solid State Sciences

Abstract:The concept of a 'phonon-liquid electron-crystal' has received significant interest in recent years, with copper selenide (Cu 2 Se) emerging as one of the high-performance thermoelectric materials within this framework. This study focuses on the fabrication of Cu 2 Se bulk pellets through a low-temperature sintering method known as cold sintering process (CSP). The introduction of a liquid phase (thiol-amine solution) in this process facilitates the dissolution and precipitation of ion/atom clusters, resulting in sample densification. Remarkably, a sample density of nearly 90 % is achieved at a low sintering temperature of only 473 K. Furthermore, this CSP approach preserves the morphology of the Cu 2 Se precursor powders and effectively inhibits grain growth. Consequently, the lattice thermal conductivity of the CSP samples is significantly reduced, attributed to enhanced grain boundary phonon scattering. This leads to a substantial improvement in the figure-of-merit ( ZT ), increasing from 0.65 at 800 K in the hot-pressed sample to 2.13 at 800 K in the CSP sample. The advantages of CSP can be extended beyond Cu 2 Se, as it holds promise for enhancing the performance of various high-performance thermoelectric materials.

chemistry, physical, inorganic & nuclear,physics, condensed matter