Dispersion and Polishing Mechanism of a Novel CeO2-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass
Zifeng Zhao,Zhenyu Zhang,Chunjing Shi,Junyuan Feng,Xuye Zhuang,Li Li,Fanning Meng,Haodong Li,Zihang Xue,Dongdong Liu
DOI: https://doi.org/10.3390/ma16031148
2023-01-29
Abstract:Quartz glass shows superior physicochemical properties and is used in modern high technology. Due to its hard and brittle characteristics, traditional polishing slurry mostly uses strong acid, strong alkali, and potent corrosive additives, which cause environmental pollution. Furthermore, the degree of damage reduces service performance of the parts due to the excessive corrosion. Therefore, a novel quartz glass green and efficient non-damaging chemical mechanical polishing slurry was developed, consisting of cerium oxide (CeO2), Lanthanum oxyfluoride (LaOF), potassium pyrophosphate (K4P2O7), sodium N-lauroyl sarcosinate (SNLS), and sodium polyacrylate (PAAS). Among them, LaOF abrasive showed hexahedral morphology, which increased the cutting sites and uniformed the load. The polishing slurry was maintained by two anionic dispersants, namely SNLS and PAAS, to maintain the suspension stability of the slurry, which makes the abrasive in the slurry have a more uniform particle size and a smoother sample surface after polishing. After the orthogonal test, a surface roughness (Sa) of 0.23 nm was obtained in the range of 50 × 50 μm2, which was lower than the current industry rating of 0.9 nm, and obtained a material removal rate (MRR) of 530.52 nm/min.