Numerical Stress Analysis of TBCs at Film Cooling Hole's Edge based on TBC-Film Cooling System

Da Qiao,Wu Zeng
DOI: https://doi.org/10.1007/s11666-024-01863-8
IF: 2.839
2024-11-21
Journal of Thermal Spray Technology
Abstract:It is of great significance to better clarify the failure mechanism of thermal barrier coatings (TBCs) with film cooling hole edges to prolong the TBCs' service life. In this paper, a numerical study of the film cooling model of flat plate with TBCs is carried out. The temperature field distribution of the TBCs is obtained by conjugate heat transfer, and the stresses of the TBCs at the edge of the film cooling hole are analyzed under real operating conditions, taking into account the TGO growth, plasticity, and creep properties of the material. The results show that due to the lower temperature of the film cooling hole edge, the TGO growth is slowed down, and the free-edge effect brought by the film cooling hole will play a large influence on the coating stress. The TBCs will have a large interfacial stress at the room temperature stage, and it will be more prone to flaking failure. The substrate, on the other hand, bears a larger stress in the high temperature stage.
materials science, coatings & films
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