Effect of Rare Earth Y on Liquid Film of Later Solidification Stage and Hot Tearing of Spherical Al-Cu-Mg Alloy

Shiwei Wang,Chunyu Yue,Jian Kang,Xiaoguang Yuan
DOI: https://doi.org/10.1007/s11665-024-09592-3
IF: 2.3
2024-05-23
Journal of Materials Engineering and Performance
Abstract:Al-Cu-Mg alloys with spherical structure are prepared using mechanical vibration method. Then, the state of liquid-solid coexistence in the later stage of alloy solidification is obtained by remelting, reproducing the changes in the liquid film and the formation process of hot tearing in the later stage of solidification. Under different initial solidification states, the solidification characteristics and hot tearing behavior of Al-4Cu-1.5Mg- x Y ( x = 0-0.25) alloys are systematically researched. The results indicate that with the increase in Y element, the alloy with spherical microstructure first refines and then coarsens. Under the same remelting conditions, as the Y element increases, the size of the spherical solid first decreases and then increases, but the uniformity of liquid phase distribution gradually increases. When the Y is 0.15 wt.%, the best state of liquid phase uniformly coated spherical solid phase is formed, which is more conducive to eliminating the interference of the solid phase skeleton on the liquid film shrinkage detection in the later solidification stage. Under the same remelting conditions, with the increase in Y element, the crack initiation shrinkage force and corresponding solid fraction of the alloy first increase and then decrease. When the Y element is 0.15 wt.% and the liquid film fraction is 30-33%, the alloy does not exhibit significant hot tearing. The adding appropriate amount of Y element not only reduces the tendency of spherical crystal alloys to form closed zones, but also enhances the feeding ability of the liquid film in the later stage of solidification, thereby reducing shrinkage porosity and the hot tearing tendency of alloys.
materials science, multidisciplinary
What problem does this paper attempt to address?