High-performance 4H-SiC EUV Photodiode with Lateral p-n Junction Fabricated by Selective-area Ion Implantation

Yifu Wang,Zhiyuan Wang,Weizong Xu,Feng Zhou,Dong Zhou,Fangfang Ren,Dunjun Chen Rong Zhang,Youdou Zheng,Hai Lu
DOI: https://doi.org/10.1109/led.2024.3381129
IF: 4.8157
2024-01-01
IEEE Electron Device Letters
Abstract:In this work, a 4H-SiC EUV photodiode (PD) with lateral p-n junction formed by selective-area ion implantation is investigated, in which grid-shaped p-type contact region is designed for enhancing effective EUV light absorption. The large area SiC PD with 9 mm diameter exhibits a low dark current density of ~9 pA/cm2 and a high responsivity of 0.07 A/W at 13.5 nm under 5 V reverse bias. The detectivity of PD is further determined to be ~5.9×1012 cmHz0.5W-1 based on 1/f noise test. Two-dimensional photocurrent mapping of photosensitive area indicates that the non-uniformity of photo-responsivity at 13.5 nm is less than 0.67%. When tested by using a 266 nm pulse laser, the PD shows a fast rise time of ~4.3 ns in transient response measurement. The PD also exhibits low dark current, stable capacitance and responsivity at elevated temperatures up to 150 °C, suggesting that the detector has good potential for high-temperature operation.
engineering, electrical & electronic
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