Characteristics of Thermal Stress Evolution During the Cooling Stage of Multicrystalline Silicon
Haisheng Fang,Quanjiang Zhang,Yaoyu Pan,Sen Wang,Naigen Zhou,Lang Zhou,Maohua Lin
DOI: https://doi.org/10.1080/01495739.2013.788902
IF: 3.456
2013-01-01
Journal of Thermal Stresses
Abstract:Directional solidification is one of the most popular techniques for the massive production of multicrystalline silicon (mc-Si) for solar cell application due to its well-balanced high conversion efficiency and low production cost. The grown crystal suffers from several types of defects that significantly degrade the photovoltaic performance of solar cells, among which dislocation is the most critical caused by thermal stress. To examine the characteristics of thermal stress and associated fields, therefore, it is significant for the understanding and optimization of the cooling process. In the article, an integrated simulation tool has been developed and used to investigate heat transfer, fluid flow, and thermal stress during the cooling process of mc-silicon. The simulation results were further proved by experimental observations. According to the distortion energy theory, the total strain energy consists of the volumetric strain energy and the shear strain energy, and yield occurs when the shear component exceeds that at the yield point, which is the major cause of the dislocation. Therefore, by analyzing von Mises stress aligned in the direction that has to support the maximum shear load, the regions in the ingot with dislocation generation and multiplication can be evaluated. The displacement indicates the motion of the crystal ingot, and reveals the regions of deformation due to the existence of thermal stress from uneven cooling. Based on the complete investigation of the characteristics of thermal stress and associated displacement, the cooling process could be well comprehended and further optimized with the minimization of dislocation density.