Evolution Mechanism of Solid–Liquid Interface of Large-Sized Bulk Polysilicon via Si–Sn Solution Growth

Yongsheng Ren,Hui Chen,Wenhui Ma,Yi Zeng,Kazuki Morita
DOI: https://doi.org/10.1021/acs.cgd.1c01512
2022-03-11
Abstract:A Si–Sn alloy melt solution was employed to grow large-area bulk Si while overcoming difficulties associated with high-temperature crystal transformation. Electron backscattered diffraction characterization of the solution-grown Si, hybridized with theoretical calculation, enabled identification of the primary dendrite and elucidated the preferential formation of grains in the bulk crystal. Migration of the solid–liquid solution interface during directional solidification was simulated at macroscopic and microscopic scales to estimate the interfacial energy at different temperature gradients. Residual concentrations of Sn in the bulk primary Si were found to be significantly closer to the solid solubility limit than impurity concentrations in Si previously grown from Si–Al and Si–Cu solutions.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acs.cgd.1c01512.Details for experimental procedures and characterization methods including Sample preparation process, SEM-EDS/EBSD characterization, Grain boundary construction, Grain boundary formation energy calculation, Finite element model, and LAMMPS simulation (PDF)This article has not yet been cited by other publications.
chemistry, multidisciplinary,materials science,crystallography
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