Non-invasive digital etching of van der Waals semiconductors

Jian Zhou,Chunchen Zhang,Li Shi,Xiaoqing Chen,Tae Soo Kim,Minseung Gyeon,Jian Chen,Jinlan Wang,Linwei Yu,Xinran Wang,Kibum Kang,Emanuele Orgiu,Paolo Samorì,Kenji Watanabe,Takashi Taniguchi,Kazuhito Tsukagoshi,Peng Wang,Yi Shi,Songlin Li
DOI: https://doi.org/10.1038/s41467-022-29447-6
IF: 16.6
2022-04-05
Nature Communications
Abstract:Abstract The capability to finely tailor material thickness with simultaneous atomic precision and non-invasivity would be useful for constructing quantum platforms and post-Moore microelectronics. However, it remains challenging to attain synchronized controls over tailoring selectivity and precision. Here we report a protocol that allows for non-invasive and atomically digital etching of van der Waals transition-metal dichalcogenides through selective alloying via low-temperature thermal diffusion and subsequent wet etching. The mechanism of selective alloying between sacrifice metal atoms and defective or pristine dichalcogenides is analyzed with high-resolution scanning transmission electron microscopy. Also, the non-invasive nature and atomic level precision of our etching technique are corroborated by consistent spectral, crystallographic, and electrical characterization measurements. The low-temperature charge mobility of as-etched MoS 2 reaches up to 1200 cm 2 V −1 s −1 , comparable to that of exfoliated pristine counterparts. The entire protocol represents a highly precise and non-invasive tailoring route for material manipulation.
multidisciplinary sciences
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