A route towards the fabrication of 2D heterostructures using atomic layer etching combined with selective conversion

Markus H Heyne,Daniil Marinov,Nicholas Braithwaite,Andy Goodyear,Jean-François de Marneffe,Mike Cooke,Iuliana Radu,Erik C Neyts,Stefan De Gendt
DOI: https://doi.org/10.1088/2053-1583/ab1ba7
IF: 6.861
2019-05-17
2D Materials
Abstract:Heterostructures of low-dimensional semiconducting materials, such as transition metaldichalcogenides (MX 2 ), are promising building blocks for future electronic and optoelectronicdevices. The patterning of one MX 2 material on top of another one is challenging due to theirstructural similarity. This prevents an intrinsic etch stop when conventional anisotropic dryetching processes are used. An alternative approach consist in a two-step process, where asacrificial silicon layer is pre-patterned with a low damage plasma process, stopping on theunderlying MoS 2 film. The pre-patterned layer is used as sacrificial template for the formation ofthe top WS 2 film. This study describes the optimization of a cyclic Ar/Cl 2 atomic layer etchprocess applied to etch silicon on top of MoS 2 , with minimal damage, followed by a selectiveconversion of the patterned Si into WS 2 . The impact of the Si atomic layer etc...
materials science, multidisciplinary
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