Titanium Dioxide Hole-Blocking Layer in Ultra-Thin-Film Crystalline Silicon Solar Cells

Yangsen Kang,Huiyang Deng,Yusi Chen,Yijie Huo,Jieyang Jia,Li Zhao,Zain Zaidi,Kai Zang,James S. Harris
DOI: https://doi.org/10.1109/jphot.2019.2947582
IF: 2.4
2019-12-01
IEEE Photonics Journal
Abstract:One of the remaining obstacles to achieving the theoretical efficiency limit of crystalline silicon (c-Si) solar cells is high interface recombination loss for minority carriers at the Ohmic contacts. The contact recombination loss of the ultra-thin-film c-Si solar cells is more severe than that of the state-of-art thick cells due to the smaller volume and higher minority carrier concentration. This paper presents a design of an electron passing (Ohmic) contact for n-type Si that is hole-blocking with significantly reduced hole recombination. By depositing a thin titanium dioxide (TiO<sub>2</sub>) layer, we form a metal-insulator-semiconductor (MIS) contact for a 2 μm-thick Si cell to achieve an open circuit voltage ($V_{oc}$) of 645 mV, which is 10 mV higher than that of an ultra-thin cell with a traditional metal contact. This TiO<sub>2</sub> MIS contact constitutes a step towards high-efficiency ultra-thin-film c-Si solar cells.
engineering, electrical & electronic,optics,physics, applied
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