Abstract:In the present technology, the manufacture of micro-electro-mechanical system (MEMS) and nano-electro-mechanical system (NEMS) are limited by the lack of mechanism of material processing, especially the mechanism of the polycrystalline materials. In this work, based on the microstructures of polycrystalline copper, the evolution mechanism of dislocations on the polycrystalline copper nanoindentation surface is researched by the four types of microstructures in polycrystalline materials, including grain cell, grain boundary, triple junction and vertex points. In addition, the coordination number, internal stress and atomic potential energy of the dislocations defects are also considered. The results show that when the microstructures with high dimension number carry the compressive stress, the adjacent microstructures with low dimension number appear tensile stress and the microstructures with lower dimension number like vertex points is more likely to appear tensile stress. The dislocation atoms accumulate high internal stress and atomic potential energy during the dislocation nucleation. The internal stress of the imperfect dislocation atoms at the dislocation edge is higher than that of the stacking layer atoms inside the dislocations during the dislocation growth. The process of nucleation and growth, and the internal stress accumulation and release both have similar directionality. They both firstly extended to the microstructures with lower dimension number like vertex points and triple junction, and then expend to and stop at the grain boundary with high dimension number.

Orientation dependence of dislocation structure in surface grain of pure copper deformed in tension

Orientation dependence of dislocation structure in surface grain of pure aluminium deformed in tension

Inclination-governed Deformation of Dislocation-Type Grain Boundaries

Dislocation Structures In Deformed Metals

Evolutions of Grain Orientation and Dislocation Boundary in Aa1050 Aluminum Alloy During Cold Rolling from Low to Medium Strains

Interactions between edge lattice dislocations and Σ11 symmetrical tilt grain boundaries in copper: A quasi-continuum method study

Dislocation Boundary Structure from Low to Medium Strain of Cold Rolling AA3104 Aluminum Alloy

Edge Dislocations Interacting with a Σ11 Symmetrical Grain Boundary in Copper Upon Mixed Loading: A Quasicontinuum Method Study

Arrangement and Decomposition of Grain Boundary Dislocations: Two-Mode Phase-Field Crystal Simulation

Grain Orientation Dependence of Extended Planar Dislocation Boundaries in Rolled Aluminium

On Intrinsic Brittleness and Ductility of Intergranular Fracture along Symmetrical Tilt Grain Boundaries in Copper

Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading

Double-inverse Grain Size Dependence of Deformation Twinning in Nanocrystalline Cu

Deformation Mechanism of Metastable Oriented Grains in High-Purity Tantalum under Different Strain Paths

Grain Orientation Dependence of Extended Planar Dislocation Boundaries in Cold-Rolled Polycrystalline Aluminium

Molecular Dynamics Simulation of Surface Effect on Tensile Deformation of Single Crystalline Copper

Research of Surface Defects of Polycrystalline Copper Nanoindentation Based on Microstructures

The Grain Size and Orientation Dependence of Geometrically Necessary Dislocations in Polycrystalline Aluminum During Monotonic Deformation: Relationship to Mechanical Behavior

Prediction of yield surface of single crystal copper from discrete dislocation dynamics and geometric learning

The inhibiting effect of dislocation helices on the stress-induced orientation of S' precipitates in Al–Cu–Mg alloy

Grain-Size-Dependent Zero-Strain Mechanism for Twinning in Copper