Abstract:Advanced packaging technologies such as 2.5D Si TSV interposer, Fanout RDL interposer and 3D hybrid bonding packaging have been developed for chiplets and system heterogeneous integrations to fulfil the continuous pursuit of higher performance, higher bandwidth, lower power consumption, higher capacity and lower cost. However, the new heterogeneous integration solutions especially for HPC, AI and edge computing applications have also urged the demands for the laminated substrates with higher density interconnects and larger footprint body sizes. Conventional laminated substrate such as flip-chip ball grid array (FCBGA) package with multi-layer (typically over 10 layers) will suffer higher cost from the yield loss with the increasing substrate layer counts and body size.In this paper, the new packaging solutions of combining high density fanout with laminated substrate were developed. Two different high density fanout (FO) solutions named chip first and chip last for a single ASIC chip on standard ABF laminated substrates with different body sizes and layer counts were introduced. This new packaging technology was called Fanout BGA (FOBGA). The passive components were also embedded on redistribution layer (RDL) for FO chip last hybrid substrate. The test vehicles and process flows for both FOBGA chip first and chip last solutions were also elaborated. The warpage of different TVs was also demonstrated. Furthermore, the package signal integrity (SI) and power integrity (PI) performance for FO on substrate were conducted by electrical stimulations. The impacts of RDL routing and RDL line and spacing (L/S) on electrical performance of FOBGA package were also discussed. Finally, the design guidance of FO on substrate to improve the performance by reducing substrate layer counts were proposed. The high density FO on substrate has provided the higher density interconnect than that of conventional laminated substrate, it also has demonstrated the flexibility to reuse substrate and good potential to leverage standard laminate substrate without increasing body size and layer counts for high performance applications.

The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

Redistribution Layer Technique with Multilayer SU-8 for the Integration of Millimeter-Wave Transceiver Front-End

Fabrication and High-Frequency Characterization of Low-Cost Fan-In/out WLP Technology with RDL for 2.5D/3D Heterogeneous Integration

FOWLP Design for Digital and RF Circuits

Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging

Characterization of Molding Compound Material and Dielectric Layer of RDL

Patterned Microstructure Array Fabrication By Using A Novel Standing Surface Acoustic Wave Device

A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

Development of a Reliable High-Performance WLP for a SAW Device

Reliability of RDL Structured Wafer Level Packages

Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers

Antenna in Package Design and Measurement for Millimeter-Wave Applications in Fan-out Wafer-Level Package.

A Fan-Out Wafer-Level Package Technology for Millimeter-Wave Monolithic Integrated Circuits

Design And Optimization Of Redistribution Layer (Rdl) On Tsv Interposer For High Frequency Applications

Design and Simulation to Reduce the Crosstalk of Ultra-Fine Line Width/space in the Redistribution Layer

Advanced Fanout Packaging Technology for Hybrid Substrate Integration

Development of a wideband medical ultrasonic linear array transducer with a double-sided FPCB

Acoustofluidic Waveguides for Fabrication of Localized Polymeric Microstructure Arrays

FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays

Precise Modulation of the Debonding Behaviours of Ultra-Thin Wafers by Laser-Induced Hot Stamping Effect and Thermoelastic Stress Wave for Advanced Packaging of Chips

Research of Temperature Cycling Reliability of Wafer Level Packages with Redistribution Layer