Cu Direct Nanopatterning Using Solid‐State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface (Adv. Mater. Interfaces 9/2024)

Atsuki Tsuji,Eita Morimoto,Masaru Takizawa,Junji Murata

DOI: https://doi.org/10.1002/admi.202470024

IF: 5.4

2024-03-23

Advanced Materials Interfaces

Abstract:Solid‐State Electrochemical Etching In article 2300896, Junji Murata and co‐workers present an advanced, eco‐friendly electrochemical technique using a polymer electrolyte membrane stamp for high‐resolution copper patterning. This method eliminates liquid electrolytes, reducing environmental impact and enabling nanometer‐precision copper patterns without resists, marking a significant leap in electronic device manufacturing efficiency.

materials science, multidisciplinary,chemistry