Abstract:Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

Flexible and Transparent Cu Electronics by Low‐Temperature Acid‐Assisted Laser Processing of Cu Nanoparticles

Cu Electrode Fabrication by Acid-assisted Laser Processing of Cu Nanoparticles and Application with Transparent·Flexible Electrode

Low‐Cost Facile Fabrication of Flexible Transparent Copper Electrodes by Nanosecond Laser Ablation

Site-selective Fabrication of Patterned Transparent Copper Mesh on Flexible Substrates at Mild Temperature for Green, Low Cost Electronics

Flexible Fabrication of Flexible Electronics: A General Laser Ablation Strategy for Robust Large‐Area Copper‐Based Electronics

A Facile Process Combined with Inkjet Printing, Surface Modification and Electroless Deposition to Fabricate Adhesion-Enhanced Copper Patterns on Flexible Polymer Substrates for Functional Flexible Electronics

One-step Selective Laser Patterning of Copper/graphene Flexible Electrodes

Enhanced Antioxidant and Size Controllable Cu@Ag Core-Shell Nanoparticles Conductive Inks for Flexible Printed Electronics

Spatially Modulated Femtosecond Laser Direct Ablation-Based Preparation of Ultra-Flexible Multifunctional Copper Mesh Electrodes and Its Application

Next Generation Non-Vacuum, Maskless, Low Temperature Nanoparticle Ink Laser Digital Direct Metal Patterning for a Large Area Flexible Electronics

The Laser Writing of Highly Conductive and Anti-Oxidative Copper Structures in Liquid

Fabrication of Flexible Copper Microelectrodes Using Laser Direct Writing for Sensing Applications

Electroless Plating Cycle Process for High-Conductivity Flexible Printed Circuits

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Ingenious Method for Rapid Fabrication of a Highly Conductive Hybrid Film of Printed Cu Nanoparticle Layers Plated by Ag Nanoplates on a PET Substrate at Room Temperature

Laser-Assisted Photo-Thermal Reaction for Ultrafast Synthesis of Single-Walled Carbon Nanotube/Copper Nanoparticles Hybrid Films as Flexible Electrodes

Highly Conductive and Transparent Copper Nanowire Electrodes on Surface Coated Flexible and Heat-Sensitive Substrates

Transparent Electrodes Based on Ultrathin/ultra Smooth Cu Films Produced Through Atomic Layer Deposition As New ITO-free Organic Light-Emitting Devices

Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

High-performance Flexible Transparent Conductive Films Based on Copper Nanowires with Electroplating Welded Junctions