Abstract:The recently developed microscale inorganic light-emitting diodes (mu-ILEDs) have attracted much attention due to their potential use in biointegrated applications such as optogenetics. It is critical to understand the thermal properties of mu-ILEDs since excessive heating may reduce the performance significantly. A three-dimensional analytical model based on the Fourier Cosine transform is developed to study the thermal properties of rectangular mu-ILEDs in this paper. The analytical prediction agrees well with finite element analysis. A scaling law for the normalized temperature increase of a single mu-ILED is established in terms of four non-dimensional parameters: the normalized shape factor gamma = b/a, the normalized mu-ILED thickness (H) over bar (LED) = H-LED/a, and chi(1) = k(m)H(m)/(k(s)a) and chi(2) = k(s)H(B)/(k(B)a) , where a and b are the half-lengths of the mu-ILED, k and H are the thermal conductivity and the thickness with the subscripts LED, m, B and s for the mu-ILED, metal layer, encapsulation layer and substrate, respectively. The influences of these non-dimensional parameters on the normalized temperature increase are systematically investigated. The temperature increase for rectangular mu-ILED array is then obtained analytically by the method of superposition. These results provide design guidelines to minimize the adverse thermal response of rectangular mu-ILEDs. (C) 2017 Elsevier Ltd. All rights reserved.

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