Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification

Wanqi Zhao,Panpan Lin,Tiesong Lin,Peng He,Yan Liu,Weimin Long,Jian Li
DOI: https://doi.org/10.1016/j.jmapro.2020.09.007
IF: 5.684
2020-10-01
Journal of Manufacturing Processes
Abstract:<p>Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 °C has been successfully manufactured at 430 °C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.</p>
engineering, manufacturing
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