A new low-temperature preparation technology of heat-resistant diamond/Cu joint using composite braze: microstructure evolution and mechanical properties strengthening
Xinfei Zhang,Panpan Lin,Jincheng Lin,Wanqi Zhao,Xinyue Li,Jia Yang,Ce Wang,Tiesong Lin,Peng He,Yanli Zhuang
DOI: https://doi.org/10.1016/j.jmatprotec.2023.118194
IF: 6.3
2023-10-18
Journal of Materials Processing Technology
Abstract:A low-temperature brazing method of diamond and Cu was proposed by using composite filler of Au-Si eutectic + NiTi particle. Prior to joining, diamond surface was modified by an active alloy of AgCu28+TiH 2 , the resulting Ag-Cu coating could ensure the good wettability of Au-Si filler during brazing and formed TiC layer could ensure a tight interfacial bonding. In the brazing process, it was found that melting point depressant element of Si in Au-Si filler could be completely consumed by (i) reacted with NiTi alloy and formed NiTiSi whiskers and (ii) precipitation in form of Ti 5 Si 3 C and TiCuSi in modified layer, while the interdiffusion between Au and Cu substrate lead to a ductile seam matrix of heat-resistant (Au, Cu)ss. Attributed to the excellent plasticity and high melting temperature of (Au, Cu)ss and the strengthening effect of NiTiSi whiskers, the joint brazed at 600 °C not only have a high shear strength of 108 MPa at room temperature, but also exhibited a excellent heat-resistance, the joint showed a shear strength of 89 MPa and 28 MPa at 300 °C and 500 °C, respectively.
materials science, multidisciplinary,engineering, manufacturing, industrial