Low temperature joining of GH3039 for high temperature applications with Au-Si isothermal solidification

Wanqi Zhao,Panpan Lin,Tiesong Lin,Peng He,Weimin Long,Ruyu Tian
DOI: https://doi.org/10.1016/j.matlet.2020.128668
IF: 3
2020-01-01
Materials Letters
Abstract:•Low temperature joining enables the alleviation of residual thermal stress.•The distribution of the intermetallic compounds has been adjusted effectively.•Joint strength is increased with the Ti-modified surface of basemetal.
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