Vacuum diffusion bonding of CoCrFeNiMo MEAs and Inconel 718 using Ni interlayer

Yali Zhang,Xiaosong Jiang,Yongjian Fang,Hongliang Sun,Tingfeng Song,Defeng Mo,Xue Li,Zhiping Luo
DOI: https://doi.org/10.1016/j.matlet.2020.128509
IF: 3
2020-11-01
Materials Letters
Abstract:<p>Diffusion bonding of Co<sub>28.5</sub>Cr<sub>21.5</sub>Fe<sub>20</sub>Ni<sub>26</sub>Mo<sub>4</sub> medium-entropy alloys (MEAs) and Inconel 718 (IN718) using Ni interlayer was studied. The results showed that interface layer I (IL-I) between IN718 and Ni interlayer mainly consisted of Ni solid solution (Ni(ss)), and interface layer II (IL-II) between MEAs and Ni interlayer mainly consisted of Ni(ss) and less μ phase. When bonding temperature was 950°C, the better solid solution strengthening effect was produced at interface, so maximum average tensile strength of the bonded joints was 1627.92 MPa.</p>
materials science, multidisciplinary,physics, applied
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