Interfacial reaction and microstructure investigation of CoCrFeNiMo medium-entropy alloys diffusion-bonded joints

Yali Zhang,Xiaosong Jiang,Hongliang Sun,Tingfeng Song,Defeng Mo,Xue Li,Zhiping Luo
DOI: https://doi.org/10.1016/j.matlet.2020.128008
IF: 3
2020-09-01
Materials Letters
Abstract:<p>In this study, vacuum diffusion bonding of non-equiatomic CoCrFeNiMo medium-entropy alloys (MEAs) was successfully achieved. The maximum tensile strength was found to be 597.13 MPa for the bonded joint prepared at 1050 °C. A nano-scale metal oxide film (Cr<sub>3</sub>O<sub>4</sub>) was formed at the welded joints which reduced the performance of the bonded joints. With the increase of bonding temperature, Cr<sub>3</sub>O<sub>4</sub> gradually decreased, and the metal oxide film was broken and disappeared at 1050 °C due to diffusion of O elements to the substrate.</p>
materials science, multidisciplinary,physics, applied
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